Method for forming blade material particles special for wire-electrode cutting of semiconductor material and ultra-hard material

Abstract

The invention discloses a method for forming blade material particles special for wire-electrode cutting of a semiconductor material and an ultra-hard material, which comprises the steps of: 1, selecting a 6H-SiC silicon carbide or silicon carbide compound diamond ultra-hard material as a raw material; 2, feeding the raw material into a grinding machine to be ground; 3, carrying out primary grading on ground powder by an air inducing device, selecting fine particles with 16 micrometers for carrying out secondary grading, returning rough particles with 16 micrometers to the grinding machine to be continuously ground; 4, feeding finished particles of 16-5 micrometers through secondary grading to a packaging bin for packaging; and 5, feeding the fine particles with micrometer grade as a secondary product to a cyclone device for collecting. The particle forming method can meet the requirement for particle forming of free multiple wire-electrode cutting of the semiconductor material at present on a particle blade product, also satisfies the requirement for the preparation formation of blade particles special for a solidification jigsaw, lays the technical foundation for the free multiple wire-electrode cutting of the semiconductor material, and becomes the low-consumption and pollution-free processing manner.

Description

technical field [0001] The invention relates to a wire cutting blade material, in particular to a method for forming special blade material particles for wire cutting of semiconductor materials and superhard materials. Background technique [0002] Most of the first-generation and second-generation semiconductor materials use silicon carbide micropowder and polyethylene glycol as the cutting slurry for multi-wire cutting. A large amount of slurry waste is generated during the production process, which belongs to high resource consumption and high cost. Pollution and environmentally unfriendly production methods; or the production method of diamond wire saw adopted by very few enterprises in the industry. Due to the influence of diamond powder production capacity and price, the processing cost is more than 10 times that of the previous production method. As the preparation of special cutting edge particles for semiconductor materials, jet milling and classification (including...

AI Technical Summary

Problems solved by technology

Because the output rate of the product prepared by the above method is low (the single number output rate of wet ball milling is only 9%, and the output rate of dry ball mill classifier improved by Raymond Mill can only reach 52%), the production efficiency is low ( A single wet ball mill is only about 30kg / h, and the jet mill can only reach about 200kg / h), high energy consumption, and the power consumption per ton is above 1000 degrees, and the noise generated during the production process is generally above 80dB

As the raw material of the cutting edge, since ordinary silicon carbide and diamond are used, in order to meet the multi-wire cutting of second-generation semiconductor materials such as solar-grade silicon wafers, integrated circuit chips, and gallium arsenide, and the requirements of the sapphire LED lining industry According to product requirements, when using the above method to prepare cutting blade particles, sulfuric acid, hydrofluoric acid, hydrochloric acid, etc. must be used for chemical treatment, which in turn causes a large amount of waste water, waste gas and solid waste to pollute the environment

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