Light-emitting semiconductor module structure and manufacturing method thereof
A light-emitting semiconductor and module structure technology, applied in semiconductor devices, electrical components, circuits, etc., can solve problems such as poor heat dissipation, temperature quenching, and poor heat dissipation performance, so as to avoid poor heat dissipation of products, prevent oxidation or moisture, The effect of improving productivity
Inactive Publication Date: 2011-01-26
敬俊
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Problems solved by technology
[0005] 1. Due to the existence of light heat dissipation, the light-emitting efficiency of light-emitting semiconductor chips is low;
[0006] 2. After the phosphor coating is potted with glue, the heat dissipation performance is poor. When it is irradiated by ultraviolet light, it is prone to temperature quenching and aging, which reduces the luminous efficiency.
[0007] 3. When pouring the glue, due to the thickening of the glue during use, phosphor precipitation occurs, resulting in chromatic aberration;
[0008] 4. The light-emitting semiconductor chip is fixed by pouring glue, and its heat dissipation surface is mainly fixed on the side of the aluminum base, and the aluminum base is separated between the light-emitting semiconductor chip and the heat sink, so that the thermal resistance between the light-emitting semiconductor chip and the heat sink is relatively large. The cooling effect is not good
Method used
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[0029] Below in conjunction with accompanying drawing, the present invention will be further described:
[0030] Such as figure 1 , figure 2 A plurality of light-emitting semiconductor chips 1 are directly fixed and installed on the top of the heat sink 3, which are connected by a printed circuit compounded on the surface of the heat sink 3, and a light guide cover 4 is installed on the top of the heat sink. In the airtight cavity formed by the cover and the heat sink, the light-emitting semiconductor chip can better perform heat exchange in the airtight cavity, and the airtight cavity can prevent the chip from being oxidized or damp. The material of the light guide cover can be a glass cover, a glass-ceramic cover or a nano-ceramic material cover, and the distance between the light guide cover and the chip depends on the light output efficiency of the light-emitting semiconductor module.
[0031] The surface of the light guide cover is coated with or mixed with light-chang...
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The invention relates to a light-emitting semiconductor module structure, comprising a heat sink holder and more than one light-emitting semiconductor chips; wherein the light-emitting semiconductor chip is directly fixed on the heat sink holder, the upper part of the heat sink holder is provided with a light guide cover, and the light-emitting semiconductor chip is arranged in a closed cavity formed by the light guide cover and the heat sink holder. No gel is used for filling and sealing the light-emitting semiconductor chip, the light-emitting semiconductor chip can exchange more heat with the closed cavity, and heat on the surface of chip is conducted to outside, thus reducing the working temperature of chip; the heat sink holder and the light guide cover form a closed cavity, so that the work environment of chip is isolated with outside, thus being beneficial to preventing the chip from oxidation or moisture, preventing the chip from damage and being beneficial to prolonging working life of chip; and processing and production thereof are simple, thus being beneficial to improving production efficiency.
Description
technical field [0001] The invention relates to the field of illumination, in particular to an illumination light-emitting semiconductor module and a manufacturing method thereof. Background technique [0002] In the field of lighting, light-emitting semiconductor lighting is known as the third revolution in the history of human lighting for its features such as energy saving, environmental protection, long life, maintenance-free, and easy control. However, due to the limitations of existing manufacturing technologies, there are still some technical difficulties in light-emitting semiconductor lighting, which makes the price relatively high. [0003] In the prior art, the general processing method of light-emitting semiconductors is as follows: the light-emitting semiconductor chip is fixed on an aluminum substrate with a circuit, the surface of the chip is coated with a phosphor coating, and after the chip and the phosphor coating are filled with glue, then the The aluminu...
Claims
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Login to View More IPC IPC(8): H01L33/64H01L33/58
Inventor 敬俊林娇燕
Owner 敬俊