Double-sided graphic chip right-handed electroplating-etching module packaging method

Abstract

The invention relates to a double-sided graphic chip right-handed electroplating-etching module packaging method, comprising the following steps: taking a metal substrate; electroplating and coating a metal layer on the front face of the metal substrate; etching the rear face of the metal substrate; encapsulating a packless plastic package material (epoxy resin) on the rear face of the metal substrate; etching the front face of the metal substrate; embedding chips; bonding a metal wire; encapsulating a packed plastic package material on the front face of the semi-finished product; electroplating and coating a metal layer on the rear face of a pad and a pin; and cutting so as to separate the original chips connected in a row array integration manner one by one, and finally obtaining the finished product of a double-sided graphic chip right-handed module package structure. The chip package structure obtained by the method of the invention avoids the pin-dropping problem and shortens the length of the metal wire.

Description

(1) Technical field [0001] The invention relates to a method for packaging a double-sided graphics chip, first plating, and then engraving a module. It belongs to the technical field of semiconductor packaging. (2) Background technology [0002] The traditional manufacturing method of the chip packaging structure is: after chemical etching and surface electroplating are carried out on the front side of the metal substrate, the production of the lead frame is completed (such as Figure 85 shown). The backside of the leadframe is etched during the packaging process. This law has the following shortcomings: [0003] Because only half-etching work is done on the front of the metal substrate before plastic sealing, and the plastic sealing material is only half a foot high to cover the pins during the plastic sealing process, so the binding ability between the plastic package and the pins becomes smaller. If the plastic package is considerate When the chip is not very good on t...

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Problems solved by technology

[0004] In addition, due to the long distance between the chip and the pin, the length of the metal wire is long, such as Figures 87-88 As shown, the cost of metal wires is high (especially expensive pure gold metal wires); also due to the long length of metal wires, the signal output speed of the chip is slow (especially for storage products and those that require a large amount of data) calculation, more prominent); also because the length of the metal wire is longer, the interference of the parasitic resistance / capacitance and the parasitic pole existing in the metal wire to the signal is also higher; and because the chip and the pin between The longer the distance, the larger the volume and area of ​​the package, the higher the material cost, and the more waste

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