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Alkaline cyanide-free copper plating electroplating solution with aminomethylene diphosphonic acid as the main complexing agent

An aminomethylidene bisphosphonic acid and cyanide-free copper plating technology, applied in the field of surface treatment, can solve the problems of environmental pollution, low cathode current efficiency of cyanide plating solution, low deep plating ability, etc., and achieve the effect of reducing steric hindrance effect

Inactive Publication Date: 2011-12-21
HANGZHOU AMAER TECH +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The invention provides an alkaline cyanide-free copper plating solution that does not contain cyanide, which solves the serious environmental pollution caused by the cyanide-containing plating solution in the prior art, and the cathodic current efficiency of the cyanide plating solution is low and the deep plating ability is low. Small and other defects

Method used

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  • Alkaline cyanide-free copper plating electroplating solution with aminomethylene diphosphonic acid as the main complexing agent
  • Alkaline cyanide-free copper plating electroplating solution with aminomethylene diphosphonic acid as the main complexing agent
  • Alkaline cyanide-free copper plating electroplating solution with aminomethylene diphosphonic acid as the main complexing agent

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Embodiment 1

[0015] An alkaline cyanide-free copper plating solution composed of aminomethylene diphosphonic acid as the main complexing agent was prepared according to the following proportions.

[0016]

[0017] Dissolve and mix the weighed aminomethylene diphosphonic acid and copper sulfate pentahydrate with deionized water, add potassium hydroxide solution while stirring, and finally add a certain amount of potassium carbonate and stir until completely dissolved.

[0018] In the obtained solution, adjust the temperature of the solution to 25°C, and the cathode current density is 1.5A / dm 2 Copper plating of about 6 microns is plated on the Φ2mm steel wire substrate, and the electroplating time is 15 minutes. According to ASTM B452-2002, the binding force is tested by winding method.

Embodiment 2

[0020] An alkaline cyanide-free copper plating solution composed of aminomethylene diphosphonic acid as the main complexing agent was prepared according to the following proportions.

[0021]

[0022] Dissolve and mix the weighed aminomethylene diphosphonic acid and copper chloride dihydrate with deionized water respectively, add sodium hydroxide solution while stirring, and finally add quantitative sodium carbonate and stir until completely dissolved.

[0023] Zinc die-casting parts that have undergone ultrasonic degreasing and pre-activation treatment are charged into the tank for electroplating in the above solution. During electroplating, the temperature of the solution is controlled at 50°C and the cathode current density is 3A / dm. 2 , Plating time is 10 minutes. According to the electronic industry standard SJ1282-1977, the copper-plated zinc die-casting is quenched at 200 °C to prevent the coating from bubbling.

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Abstract

Alkaline copper plating electroplating solution with aminomethylene diphosphonic acid as the main complexing agent, involving the field of cyanide-free electroplating, the main components of the plating solution are: aminomethylene diphosphonic acid (AMDP) concentration The concentration of copper ions is 3-25g / L, the concentration of carbonate ions is 10-80g / L, and the pH of the solution is adjusted to 7.5-13.5 with sodium hydroxide or potassium hydroxide. The plating solution of the present invention has simple formula, no cyanide pollution, good deep plating ability, high cathodic current efficiency, small concentration polarization generated in the electroplating process, wide range of allowable current density, and can be used on iron substrates, zinc or zinc alloy substrates 1. Direct copper plating on the aluminum galvanized material, and obtain a copper coating with excellent bonding force with the substrate.

Description

(1) Technical field [0001] The invention relates to a new alkaline cyanide-free copper plating solution, especially an alkaline cyanide-free copper plating solution with aminomethylene diphosphonic acid (AMDP) as the main complexing agent, which is used for iron, zinc or zinc Metal substrates such as alloys and galvanized aluminum are directly plated with copper, and can also be used for thickening the copper plating, which belongs to the technical field of surface treatment. (2) Background technology [0002] Because the acidic copper sulfate electroplating solution will directly plate copper on iron, zinc or zinc alloy, aluminum and other metal substrates, a displacement reaction will occur, resulting in poor bonding between the substrate and the copper coating. In order to obtain high binding force, alkaline cyanide plating solution is widely used in industry now. However, due to the very high biological toxicity of cyanide, it will cause major environmental and social s...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C25D3/38
Inventor 姜力强郑精武乔梁孙莉陈张强蒋梅燕
Owner HANGZHOU AMAER TECH