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Adhesive composition

A composition and adhesive technology, applied in the direction of adhesives, adhesive types, conductive adhesives, etc., can solve the problem that heat resistance cannot be said to be sufficient, and achieve the effect of excellent operability

Active Publication Date: 2011-02-16
TATSUTA ELECTRICWIRE & CABLE
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In addition, the existing chloroprene-based conductive adhesives do not necessarily meet the requirements in terms of adhesive strength, heat resistance, and workability depending on the application. composition, there is a problem that heat resistance cannot be said to be sufficient

Method used

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  • Adhesive composition
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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1～6、 comparative example 1～4

[0053] The three resin components shown in Table 1 were blended and dispersed in the proportions (weight ratio, converted to resin solid content) shown in the table. Dispersion was performed using a planetary mixer, heated to 85° C. and kneaded at a rotation speed of 50 rpm for 6 hours.

[0054] The following components were added and mixed to 100 parts by weight of the resin component (in terms of solid content) to prepare an adhesive composition.

[0055] Conductive particles: 55 parts by weight of metal powder (Ni powder, average particle diameter 35 μm)

[0056] Solvent: 180 parts by weight of dimethylformamide (DMF)

[0057] 80 parts by weight of cyclohexanone

[0058] 45 parts by weight of toluene

[0059] Filler (talc, average particle size 4-5μm) 50 parts by weight

[0060] Adhesion imparting agent

[0061] (manufactured by Arakawa Chemical Industry Co., Ltd., Pencell D-125) 30 parts by weight

[0062] Stabilizer (manufactured by Chiba Special Chemicals Co., Ltd....

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Abstract

Disclosed is an adhesive composition which has excellent adhesion strength, heat resistance and workability, without using halogen. The adhesive composition is suitable for applications in conductive adhesives which are especially suitable for connecting substrates. Specifically disclosed is an adhesive composition which contains a resin component that is composed of (A) 10-80 parts by weight of a polyamide elastomer, (B) 10-80 parts by weight of a polyurethane elastomer and (C) 10-80 parts by weight of a styrene-isobutylene-styrene copolymer (with the total of (A), (B) and (C) being 100 parts by weight).

Description

technical field [0001] The present invention relates to an adhesive composition excellent in adhesive strength, heat resistance, workability, etc., and particularly relates to an adhesive composition suitable for application to conductive adhesives. Background technique [0002] Chloroprene-based conductive adhesives are generally used for bonding electrode films and connectors of touch panels, connecting various film substrates, and the like (for example, Patent Document 1). [0003] However, in recent years, due to environmental problems and increasing demands for safety, halogen-free adhesives have been strongly demanded. In addition, the existing chloroprene-based conductive adhesives do not necessarily meet the requirements in terms of adhesive strength, heat resistance, and workability depending on the application. The composition has a problem that heat resistance cannot be said to be sufficient. [0004] Here, currently, there is a demand for a halogen-free conduct...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J153/00C09J11/00C09J9/02C09J175/04C09J177/00H05K1/14H01B1/22
CPCH05K2201/0133C08L75/04C09J177/00C09J153/00C08L53/00H05K3/323H05K3/361C08L77/00C08L2666/02C08L2666/20C08L2666/24
Inventor 木下淳一寺田恒彦
Owner TATSUTA ELECTRICWIRE & CABLE
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