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Light-emitting diode (LED) packaging method, LED packaging structure, LED lamp and lighting equipment

A technology of LED packaging and LED lamps, applied in lighting and heating equipment, lighting devices, electrical components, etc., can solve the problems of high temperature resistance, poor UV resistance, and low light output efficiency, and achieve excellent UV resistance and high light output efficiency , good protection effect

Inactive Publication Date: 2011-02-23
宁波市瑞康光电有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The purpose of the embodiments of the present invention is to provide an LED packaging method, which aims to solve the problems of low light extraction efficiency, high temperature resistance, and poor UV resistance of LED products packaged by traditional LED packaging methods.

Method used

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  • Light-emitting diode (LED) packaging method, LED packaging structure, LED lamp and lighting equipment
  • Light-emitting diode (LED) packaging method, LED packaging structure, LED lamp and lighting equipment
  • Light-emitting diode (LED) packaging method, LED packaging structure, LED lamp and lighting equipment

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Embodiment 1

[0034] figure 1 A flow chart of the LED packaging method provided by the first embodiment of the present invention is shown, and the details are as follows:

[0035] In step S101, the LED chip is fixed on the substrate.

[0036] Wherein, the substrate is provided with an alloy layer; while the LED chip is fixed on the substrate, it is in contact with the alloy layer. The alloy layer is usually an alloy coating.

[0037] In step S102, the LED chip is electrically connected to the lead frame fixed on the substrate.

[0038] In step S103, the LED chip is encapsulated with molten glass to form a glass encapsulation layer, the heat of the molten glass can melt the alloy layer, and the melted alloy layer is bonded with the LED chip to form a eutectic.

[0039] In the above step S103, the alloy material melts (phase transition occurs) and absorbs a large amount of heat, thereby avoiding damage to the LED chip by the high-temperature glass.

[0040] The refractive index and light ...

Embodiment 2

[0042] figure 2 and image 3 shows a schematic top view of the substrate structure provided by the second embodiment of the present invention, Figure 4 A schematic cross-sectional structure diagram of the substrate structure provided by the second embodiment of the present invention is shown, and for convenience of description, only parts related to the embodiment of the present invention are shown.

[0043] In the embodiment of the present invention, fixing the LED chip 2 on the substrate 1 can be achieved by the following method: a groove 6 with a slot 7 is provided on the substrate 1, and the size and shape of the groove 6 is consistent with that of the LED chip 2. Adapted in size and shape, it is used to place the LED chip 2. The inner wall of the groove 6 is provided with an alloy layer 3. When the LED chip 2 is placed in the groove 6, the alloy layer 3 and the LED chip 2 are in contact with each other. The draw-in groove 7 is positioned at the edge of the groove 6, a...

Embodiment 3

[0045] Figure 6 and Figure 7 A schematic cross-sectional structure diagram and a schematic top view structure diagram of the lead frame structure provided by the third embodiment of the present invention are shown, and for convenience of description, only parts related to the embodiment of the present invention are shown.

[0046] In the embodiment of the present invention, one electrode end of the lead frame 4 is arranged on the upper surface of the substrate 1, and is electrically connected to the LED chip 2 through the bonding wire 9; the other electrode end of the lead frame 4 extends into the bottom of the groove 6, through Contact with the bottom of the LED chip 2 to realize the electrical connection between the two. The material of the lead frame 4 is preferably silver.

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Abstract

The invention is applied in the field of LED packaging and provides a light-emitting diode (LED) packaging method, an LED packaging structure, an LED lamp and lighting equipment. The method comprises the following steps of: fixing an LED chip on a substrate, wherein the substrate is provided with an alloy layer and the LED chip is contacted with the alloy layer; electrically connecting the LED chip with a lead frame fixed on the substrate; and packaging the LED chip by using molten glass to form a glass packaging layer, wherein the alloy layer can be molten by the heat of the molten glass andthe molten alloy layer is adhered to the LED chip to form eutectic. An LED is packaged by glass, so that the LED packaging structure with high light-emitting efficiency and excellent high temperatureresistance and ultraviolet (UV) resistance is obtained; and when the glass is used for packaging, the alloy is molten to absorb a great deal of heat of the molten glass, so that the damage to the LEDchip caused by the high temperature of the glass during packaging is avoided.

Description

technical field [0001] The invention belongs to the field of LED packaging, and in particular relates to an LED packaging method, a packaging structure, an LED lamp and lighting equipment. Background technique [0002] With the continuous development of LED in the lighting field, people have higher and higher requirements for its light extraction efficiency, and the packaging material and packaging structure of LED are the main factors affecting the light extraction efficiency. The packaging materials currently used are mainly silica gel, including methyl silica gel with a refractive index of 1.41 (referred to as "1.41 silica gel") and methylphenyl silica gel with a refractive index of 1.5 (abbreviated as "1.5 silica gel"). For 1.41 type silica gel, its reliability (high temperature resistance, ultraviolet light (UV) resistance) is much better than 1.5 type silica gel, but its oxygen and moisture permeability is relatively high, and the protection effect on the chip is not a...

Claims

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Application Information

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IPC IPC(8): F21Y101/02F21S2/00H01L33/56
CPCH01L2224/48091
Inventor 肖兆新
Owner 宁波市瑞康光电有限公司
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