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Conductive resin composition

A technology of conductive resin and resin composition, applied in conductive materials, printed circuits, electrical components, etc. dispersed in non-conductive inorganic materials, to achieve the effect of reducing cost and stable conductivity

Active Publication Date: 2013-04-17
THREEBOND FINE CHEM CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Therefore, the problem of obtaining a highly reliable and inexpensive conductive adhesive by combining strong magnetic powder and conductive powder remains unsolved

Method used

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  • Conductive resin composition
  • Conductive resin composition
  • Conductive resin composition

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1～7

[0107] The following components were prepared for the preparation of the conductive resin composition.

[0108] (A) Component: curable resin composition

[0109] Main ingredient: Bisphenol A type and F type mixed epoxy compound (EPICLON EXA-835LV manufactured by Dainippon Ink Chemical Works Co., Ltd. (DIC Corporation))

[0110] Curing agent: a mixture of 3-methyl-hexahydrophthalic anhydride and a mixture of 4-methyl-hexahydrophthalic anhydride (HN-5500 Hitachi Chemical)

[0111] ■Curing accelerator: Epoxy resin amine adduct-based curing accelerator (Amicure MY-24 manufactured by Ajinomoto Fine-Techno Co., Inc.)

[0112] ■Solvent: Xylene for industrial use (Xylene Japan Alcohol Trading Company Limited (JAPAN ALCOHOLTRADING COMPANY LIMITED))

[0113] (B) Composition: powder with strong magnetism

[0114] ■Ferrite magnet powder (NF-350 for anisotropic magnetic field orientation manufactured by DOWA Electronic Materials Co., Ltd.)

[0115] ■Ferrite magnet powder (OP-56 manufac...

Embodiment 8～14

[0151] The following components were prepared for the preparation of the conductive resin composition.

[0152] (A) Component: curable resin composition

[0153] Main ingredient: Dimethicone oil with silanol at both ends (BY16-873 manufactured by Dow Corning Toray Co., Ltd.)

[0154] ■Crosslinking agent: 3-(2-aminoethyl)aminopropyltrimethoxysilane (Z-6020 manufactured by Toray Dow Corning Co., Ltd.)

[0155] Additive: Hydrophobic fumed silica (AEROSIL R972 manufactured by Nippon Aerosil Co., Ltd.)

[0156] Catalyst: Dibutyltin disilicate triethoxylate (Neostann U-303 manufactured by Nitto Kasei Co., Ltd.)

[0157] (B) Composition: powder with strong magnetism

[0158] ■Ferrite magnet powder (NF-350 for anisotropic magnetic field orientation manufactured by DOWA Electronic Materials Co., Ltd.)

[0159] ■Ferrite magnet powder (OP-56 manufactured by DOWA Electronic Materials Co., Ltd. for anisotropic mechanical orientation)

[0160] ■Ferrite magnet powder (Isotropic BOP-K ma...

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Abstract

Provided is a conductive resin composition which has stable conductivity and is inexpensive even if the amount of conductive powder added to a curing resin composition is reduced. The conductive resin composition includes the following components (A) to (C): component (A): curing resin composition; component (B): ferromagnetic powder; and component (C): silver powder having a tap density from 0.1 to less than 1.5 g / cm3, and / or nickel powder having an apparent density from 0.1 to less than 1.0 g / cm3.

Description

technical field [0001] The present invention relates to a conductive resin composition comprising strong magnetic powder and silver powder and / or nickel powder. Background technique [0002] In the conductive resin composition, the composition called the conductive adhesive is usually composed of 5 to 25% by weight of the resin component, and metal powders such as silver powder, nickel powder, palladium powder, and gold powder (hereinafter referred to as conductive adhesive). Powder) is 65 to 95% by weight. A resin component layer exists between the metal particles, and the resin component performs dielectric breakdown to allow current to flow. If the added amount of the metal powder is less than 65% by weight, the conductivity may be unstable or may not be exhibited. This is because, unless a large amount of metal powder is filled, the layer of the resin component interposed between the metal particles becomes thick, making it difficult to achieve dielectric breakdown. I...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C08L101/00C08K3/08C08K3/22H01B1/22
CPCH05K3/321H05K2201/0272H01B1/22H05K2201/083
Inventor 铃木宏则真舩仁志
Owner THREEBOND FINE CHEM CO LTD
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