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Photosensitive conductive paste and method for producing same

A conductive paste, photosensitive technology, applied in electrode system manufacturing, discharge tube/lamp manufacturing, cold cathode manufacturing, etc. Density, good resistivity value, effect of content suppression

Inactive Publication Date: 2012-11-07
TAIYO HLDG CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0005] However, in the conductor pattern of such a thin film with a low silver powder content, it is difficult to obtain good density, and there are problems such as an increase in the resistivity value.

Method used

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  • Photosensitive conductive paste and method for producing same
  • Photosensitive conductive paste and method for producing same
  • Photosensitive conductive paste and method for producing same

Examples

Experimental program
Comparison scheme
Effect test

Embodiment

[0093] The present embodiment will be specifically described below by showing examples and comparative examples, but the present invention is not limited by these examples.

[0094] Synthesis of Organic Binders

[0095] In a flask equipped with a thermometer, a stirrer, a dropping funnel, and a reflux condenser, add methyl methacrylate and methacrylic acid at a molar ratio of 0.76:0.24, add dipropylene glycol monomethyl ether as a solvent, and add dipropylene glycol monomethyl ether as a catalyst. Azodiisobutyronitrile was stirred at 80° C. for 2 to 6 hours under a nitrogen atmosphere to obtain a resin solution.

[0096] Cool the resin solution, add methyl hydroquinone used as a polymerization inhibitor, add tetrabutylphosphonium bromide used as a catalyst, and use 0.12 moles of glycidyl methacrylate with respect to 1 mole of carboxyl groups of the above-mentioned resin Addition reaction occurs under the condition of 95-105°C for 16 hours at the addition molar ratio, and th...

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PUM

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Abstract

The invention provides a photosensitive conductive paste and a method for producing the same. Specifically, the invention provides a photosensitive conductive paste which enables to form film electrode patterns with good resistivity value and compactness. The photosensitive conductive paste is characterized in that the photosensitive conductive paste comprises organic adhesives, silver powders, photopolymerization monomers, photopolymerization initiators, organic solvents and glass powders, the silver powders satisfy a primary particle size below 0.7 Mum, a specific surface area of 1.4-2.0 m2 / g and a tap density of 2.0-5.0 g / cm3, the content of the silver powders is higher than 15 mass% of the photosensitive conductive paste and lower than 35 mass%, and the glass powders have an average particle diameter of 0.3-1.5 Mum and a softening point of 530-650 DEG C.

Description

technical field [0001] The present invention relates to a photosensitive conductive paste for forming address electrodes on a circuit board such as a plasma display panel (hereinafter referred to as PDP), and a method for producing the same. Background technique [0002] Generally, when forming conductor patterns such as electrodes on a circuit board, the following method is adopted: a conductive paste material in which metal powder is mixed with an organic binder is printed on the circuit board by a screen printing method or the like (for example, refer to Patent Document 1 etc.). [0003] In recent years, for example, along with the increase in screen size and high definition of PDPs, it is required to stably form high-definition address electrodes having a line width of 100 μm or less on circuit boards of PDPs exceeding 30 inches. However, it is difficult to form a high-definition conductor pattern on a large circuit board by such a printing technique. [0004] Therefor...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G03F7/027G03F7/004H01J17/04H01J17/49H01B1/22H01B5/14H01J9/02H01J11/22H01J11/34H05K1/09
CPCG03F7/004G03F7/0045G03F7/0047H01J11/34
Inventor 柳田伸行伊藤秀之
Owner TAIYO HLDG CO LTD