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Novel epoxy resin, method for producing the same, epoxy resin composition containing the epoxy resin as essential component, and cured product containing the epoxy resin as essential component

An epoxy resin, a new type of technology, applied in the field of epoxy resin, epoxy resin composition and epoxy resin cured product, can solve the problems of insufficient flexibility and reduced flexibility, etc.

Inactive Publication Date: 2011-04-27
NIPPON STEEL CHEMICAL CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the crosslinking density of the above-mentioned polyfunctional epoxy resin after curing increases, and although heat resistance can be obtained, the flexibility decreases.
[0004] Patent Document 1 discloses a composition, which is a photocurable composition using an epoxy functional resin, contains a bisphenol A linear epoxy resin as a polyfunctional epoxy resin, and functions as a plasticizer. The mixture of the reactive diluent and the composition of the cationic photoinitiator has high heat resistance, but there is a problem of insufficient flexibility

Method used

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  • Novel epoxy resin, method for producing the same, epoxy resin composition containing the epoxy resin as essential component, and cured product containing the epoxy resin as essential component
  • Novel epoxy resin, method for producing the same, epoxy resin composition containing the epoxy resin as essential component, and cured product containing the epoxy resin as essential component
  • Novel epoxy resin, method for producing the same, epoxy resin composition containing the epoxy resin as essential component, and cured product containing the epoxy resin as essential component

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0054] 164.5 parts of TD-EL (manufactured by 4,7-methylene-2,3-epoxy octahydro-1H-indene-ol Maruzen Petrochemical Co., Ltd.) and 160.2 parts RIKACID MH-700 (methylhexahydrophthalic anhydride, manufactured by Nippon Rika Co., Ltd.) and 17.0 parts of toluene were heated while stirring in a nitrogen atmosphere. At this time, the acid anhydride group with respect to the hydroxyl group was 0.951. The chemical formula of TD-EL is shown below.

[0055]

[0056] The reaction is carried out at 130°C until the anhydride disappears. By this reaction, a compound having one epoxy group and one carboxyl group in one molecule can be obtained. Then add CELLOXIDE 2021 (3,4-epoxycyclohexenylmethyl-3', 4'-epoxycyclohexene carboxylate) 300.8 parts, Epo Tohto ZX-1658 (cyclohexanedimethanol dishrunk Glyceryl ether) 374.4 parts, heated to make it uniform. The chemical formula of CELLOXIDE 2021 is shown below.

[0057]

[0058] As a catalyst, TPP-BB (n-butyltriphenylphosphine Bromide, ma...

Embodiment 2

[0060] TD-EL was 227.9 parts, RIKACID MH-700 was 222.2 parts, Celloxide 2021 was 200.7 parts, Epo Tohto ZX-1658 was 349.1 parts, and toluene was not used. Other than that, the same operation as in Example 1 was performed. The acid anhydride group relative to the hydroxyl group was 0.952. The epoxy equivalent of the obtained epoxy resin was 272.1 g / eq.

Embodiment 3

[0062] Put 267.1 parts of TD-EL, 232.8 parts of RIKACID MH-700, 299.9 parts of CELLOXIDE 2021, 200.2 parts of Epo Tohto ZX-1658, and 26.3 parts of toluene into the separable flask described in Example 1, stir and raise the temperature , to make it even. The reaction temperature was maintained at 90°C until the disappearance of the acid anhydride was confirmed. By this reaction, a compound having one epoxy group and one carboxyl group in one molecule can be obtained. As a catalyst, TPP-BB was dissolved in 0.1 part of acetone and added to the system. The reaction was carried out at 130° C., and the disappearance of the acid value was confirmed, which was defined as the reaction end point. The epoxy equivalent of the obtained epoxy resin was 313.9 g / eq.

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Abstract

Disclosed is a novel epoxy resin having excellent heat resistance and flexibility. The novel epoxy resin is represented by general formula (1). A method for producing the epoxy resin, an epoxy resin composition containing the epoxy resin as an essential component, and a cured product containing the epoxy resin as an essential component are also disclosed. In general formula (1), E1 and E3 represent, for example, a group represented by general formula (3); E2 represents, for example, a group represented by general formula (9); A1 and A2 represent an acid anhydride residue, namely a hydrocarbon which may contain a phosphorus, nitrogen or oxygen atom; and n represents an integer of 0-25. In general formulae (3) and (9), R represents a hydrocarbon group or a heterocyclic compound residue.

Description

technical field [0001] The present invention relates to epoxy resin, epoxy resin composition and epoxy resin cured product. , injection molding materials, electrical and electronic circuit materials, optical circuit materials, etc. Background technique [0002] Epoxy resins are excellent in adhesiveness, heat resistance, and formability, so they are used in a wide range of electronic parts, electrical equipment, automotive parts, FRP, and sporting goods. In recent years, further improvement in heat resistance has been demanded, and demand for materials having both flexibility and toughness has increased. [0003] In general, epoxy resins having high heat resistance include so-called polyfunctional epoxy resins having 2.1 or more epoxy groups in one molecule. Representative polyfunctional epoxy resins include YDPN-638 (Novolak type epoxy resin manufactured by Tohto Kasei Co., Ltd.), and YDCN-700 (cresol-novolac epoxy resin manufactured by Tohto Kasei Co., Ltd.) Wait. Howe...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08G59/20C07D303/31C07D303/40C08G59/16
CPCC08G59/186C08L63/00C07D303/40C07D303/44C07D303/31
Inventor 石原一男海东淳子
Owner NIPPON STEEL CHEMICAL CO LTD
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