Flame-retardant photocurable resin composition, dry film and cured product of same, and printed circuit board using composition thereof
A photocurable resin, flame retardant technology, applied in printed circuits, printed circuits, printed circuit manufacturing, etc., can solve the problems of dry film stability, low flame retardancy, recrystallization and other problems, and achieve environmental load. Small, improved flame retardancy, excellent flame retardancy
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[0162] The present invention will be specifically described below by showing examples and comparative examples, but the present invention is of course not limited to the following examples.
[0163]
[0164] Coordination examples 1~3, comparative coordinating examples 1~3
[0165] The components shown in Table 1 were blended in the proportions (parts by mass) shown in Table 1, pre-mixed with a mixer, and then kneaded with a 3-roll kneader to prepare a varnish of the main ingredient composition for solder resist. Here, the degree of dispersion of the obtained varnish was evaluated by particle size measurement using GRIND METER manufactured by ERICHSEN, and was 15 μm or less.
[0166] [Table 1]
[0167]
[0168]
[0169] Curing agent mix example 1, 2
[0170] The components shown in Table 2 were blended in the proportions (parts by mass) shown in Table 2, pre-mixed with a mixer, and then kneaded with a 3-roll kneader to prepare a varnish of a curing agent composition fo...
Embodiment 5～8
[0212] The flame-retardant photocurable resin composition prepared according to Examples 1 to 4 shown in Table 4 was diluted with methyl ethyl ketone, coated on a carrier film and heated and dried to form a photosensitive resin composition layer with a thickness of 20 μm. A dry film is obtained by laminating a cover film on top. Thereafter, the cover film was peeled off, and the film was bonded to the patterned polyimide film substrate using a laminator. Use an exposure device (HMW-680-GW20) equipped with a metal halide lamp to expose the solder resist pattern on the substrate at an optimal exposure amount, peel off the carrier film, and then use 1wt% Na at 30°C 2 CO 3 The aqueous solution was developed for 60 seconds under the condition of a spray pressure of 0.2 MPa to obtain a resist pattern. Thereafter, heat curing was performed for 60 minutes in a hot air drier at 150° C. to prepare a test substrate. With respect to the obtained test substrate having the cured film, ev...
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