Semiconductor chip assembly

Abstract

The invention discloses a semiconductor chip assembly. The semiconductor chip assembly at least comprises a semiconductor component, a radiating seat, a substrate and an adhesive layer, wherein the semiconductor component is electrically connected to the substrate and is thermally connected to the radiating seat; the radiating seat at least comprises a convex column and a base; the convex column extends upwards to pass through an opening of the adhesive layer and enter a through hole of the substrate; the base laterally extends and supports the substrate; the adhesive layer extends between the convex column and the substrate and between the base and the substrate; and the substrate at least comprises a first conductive layer, a second conductive layer and a dielectric layer which is positioned between the first conductive layer and the second conductive layer. Thus, the assembly can provide a vertical signal route between a bonding pad above the first conductive layer and a terminal below the adhesive layer.

Description

technical field [0001] The invention relates to a semiconductor chip assembly body, especially a semiconductor chip assembly body which is suitable for high-power semiconductor components, especially a semiconductor chip assembly body composed of a semiconductor component, a substrate, an adhesive layer and a heat sink. Background technique [0002] Semiconductor components such as packaged and unpackaged semiconductor chips can provide high voltage, high frequency and high performance applications; these applications perform specific functions, so the power consumption required is very high, but the higher the power, the semiconductor components It generates more heat. In addition, after the packaging density is increased and the size is reduced, the surface area available for heat dissipation is also reduced, resulting in increased heat generation. [0003] Semiconductor components are prone to problems such as performance degradation and shortened service life under high...

AI Technical Summary

Problems solved by technology

For example, electrical insulating materials with low thermal conductivity, such as epoxy resins, limit heat dissipation; however, electrical insulating materials with higher thermal conductivity, such as epoxy resins filled with ceramic or silicon carbide, have low adhesion and Due to the high cost of mass production, the electrical insulating material may delaminate due to heat during the production process or in the early stage of operation

If the substrate is a single-layer circuit system, the routing capability is limited, but if the substrate is a multi-layer circuit system, its excessively thick dielectric layer will reduce the heat dissipation effect

In addition, the previous technology still has problems such as insufficient performance of the heat sink, too large volume, or difficult thermal connection to the next layer of assembly, and the manufacturing process of the previous technology is not suitable for low-cost batch operation

[0020] In view of the various development situations and related limitations of the existing high-power semiconductor component packages and heat conduction plates, the general existing ones cannot meet the requirements of the industry for users in actual use. A cost-effective, reliable, suitable For mass production, multi-function, flexible adjustment of signal routing and semiconductor chip assembly with excellent heat dissipation

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