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Method and system for manufacturing component by using shadow mask technological line

A production line and technical technology, applied in semiconductor/solid-state device manufacturing, electrical components, ion implantation plating, etc., can solve problems such as inability to manufacture microelectronic components

Inactive Publication Date: 2011-07-13
潘重光
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] The first purpose of the present invention is to provide a method for manufacturing devices using a shadow mask technology production line to solve the problem in the prior art that a complete microelectronic component cannot be manufactured using a vapor deposition shadow mask process

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  • Method and system for manufacturing component by using shadow mask technological line
  • Method and system for manufacturing component by using shadow mask technological line
  • Method and system for manufacturing component by using shadow mask technological line

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Embodiment Construction

[0036] In order to further explain the technical solution of the present invention, the present invention will be described in detail below through specific examples.

[0037] like figure 1 As shown, what it shows is a method for manufacturing devices using a shadow mask technology production line of the present invention, which includes the following steps:

[0038] A. accurately positioning the shadow mask on the first region of the substrate in operable relationship to the shadow mask and the source of deposition material positioned entirely within the deposition chamber;

[0039] B. Depositing the material on the first region of the substrate by vacuum evaporation to form a pattern;

[0040] C. Accurately position the shadow mask and the deposition material source in the basic second area through the transmission device; specifically, it can choose the way of moving the substrate or the way of moving the shadow mask to realize the positioning of the second area; When the...

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Abstract

The invention discloses a method and a system for manufacturing a component by using a shadow mask technological line. The method comprises the following steps: A. firstly depositing materials in a vacuum deposition box, and then accurately locating shadow mask plates in a first area of a substrate according to the operable relationship between the shadow mask plates and deposited material sources which are fully positioned in the vacuum deposition box; B. depositing the materials on the first area of the substrate through vacuum evaporation to form a graph; C. accurately locating the shadow mask plates and the deposited material sources in a second area of the substrate by a transmission device; and D. depositing the materials on the second area of the substrate through vacuum evaporation to form a graph and stereoscopic overlap of the materials; repeating step C and D according to design so as to complete composition and connection of the component; and sequentially annealing, testing, cutting and assembling respectively by a vacuum annealing box, a vacuum test box, a vacuum cutting box and a vacuum assembling box, and finally forming the complete component.

Description

technical field [0001] The invention relates to a manufacturing method and system for constructing a production line using shadow mask technology, which is suitable for making printed circuit boards, precision electronic circuits and display boards with electronic components formed thereon. Background technique [0002] At present, the mainstream technology of microelectronics manufacturing at home and abroad is photoetching technology, and the size of photolithography machine and substrate material determines the maximum size of the output display screen and bottom plate. Existing technology cannot produce baseplates and display screens that exceed the upper limit of the size of its lithography machine, and cannot promptly and quickly meet the needs of customers with custom-sized baseplates and display screens. Large, high environmental requirements, single product and long production time and other technical problems. [0003] In response to the above problems, people hav...

Claims

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Application Information

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IPC IPC(8): H01L21/02C23C14/04C23C14/24C23C14/58H01L21/00
CPCC23C14/042C23C14/24C23C14/56
Inventor 潘重光
Owner 潘重光
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