Process for recycling circuit board micro-etching waste liquid

A circuit board and micro-etching liquid technology, which is applied in the field of circuit board micro-etching waste liquid regeneration and recycling process, can solve the problems of increased operating costs, no waste liquid recycling treatment, low copper ion concentration, etc., and achieves a high degree of automatic control and maintenance. Convenience and economic benefits

Inactive Publication Date: 2011-07-20
深圳市惠尔能科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] Existing PCB companies, that is, micro-etching waste liquid in the circuit board micro-etching process of circuit board companies, the concentration of copper ions is low, and the waste liquid is not recycled, but the common treatment is after the concentration of copper ions reaches 40g/l , discharged into the wastewater treatment system, and the copper compound is recovered by the neutralization precipitation method, and the wastewater is discharged or reused after sedimentation and filtration. This treatment process is very wasteful and does not conform to the resource-saving circular economy industrial policy. There is an urgent need to have a technical solution for the recovery and recycling of micro-etching waste liquid, so that the copper in micro-etch waste liquid can be recovered, and the waste liquid can be converted into qualified micro-e

Method used

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  • Process for recycling circuit board micro-etching waste liquid
  • Process for recycling circuit board micro-etching waste liquid

Examples

Experimental program
Comparison scheme
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Example Embodiment

[0120] Example 1-1 Preparation of adsorbent

[0121] a) After metering, mix well to form a mixture, ball mill and pulverize the mixture into the furnace, control the temperature at 145°C, keep it warm for 40 minutes, and then drop to room temperature to obtain a sintered body;

[0122] b) The sintered body is coarsely crushed to obtain powder;

[0123] c) The powder is packaged and stored for later use.

Example Embodiment

[0124] Example 1-2 Preparation of adsorbent

[0125] a) After measuring, mix well to form a mixture, ball mill and pulverize the mixture into the furnace, control the temperature at 155℃, keep it for 30 minutes, and then reduce to room temperature to obtain a sintered body;

[0126] b) The sintered body is coarsely crushed to obtain powder;

[0127] c) The powder is packaged and stored for later use.

Example Embodiment

[0128] Example 1-3 Preparation of adsorbent

[0129] a) After metering, mix well to form a mixture, ball mill and pulverize the mixture into the furnace, control the temperature at 150℃, keep it for 35 minutes, and then reduce to room temperature to obtain a sintered body;

[0130] b) The sintered body is coarsely crushed to obtain powder;

[0131] c) The powder is packaged and stored for later use.

[0132] (11) Examples of chlorine and silver ion removal in the impurity removal tank.

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Abstract

The embodiment of the invention provides a process for recycling circuit board micro-etching waste liquid. The process for recycling the circuit board micro-etching waste liquid comprises the following steps of: a, pumping the micro-etching waste liquid into a hydrogen peroxide removing tank; b, removing the hydrogen peroxide, and pumping the micro-etching waste liquid into a copper recovery tank; c, pumping the micro-etching waste liquid into a micro-etching liquid component supplementing and preparing tank; and d, returning qualified micro-etching waste liquid to a production line automatically. The embodiment of the invention also provides a device for recycling the circuit board micro-etching waste liquid. By the process for recycling the circuit board micro-etching waste liquid in the embodiment of the invention, the defects that the micro-etching waste liquid in the conventional process for micro-etching circuit boards in printed circuit board (PCB) enterprises is only simply treated to be discharged, and waste is large and resources are severely lost in the treatment process are overcome.

Description

technical field [0001] The invention relates to a circuit board micro-etching waste liquid recycling process. Background technique [0002] Existing PCB companies, that is, micro-etching waste liquid in the circuit board micro-etching process of circuit board companies, the concentration of copper ions is low, and the waste liquid is not recycled, but the common treatment is after the concentration of copper ions reaches 40g / l , discharged into the wastewater treatment system, and the copper compound is recovered by the neutralization precipitation method, and the wastewater is discharged or reused after sedimentation and filtration. This treatment process is very wasteful and does not conform to the resource-saving circular economy industrial policy. There is an urgent need to have a technical solution for the recovery and recycling of micro-etching waste liquid, so that the copper in micro-etch waste liquid can be recovered, and the waste liquid can be converted into quali...

Claims

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Application Information

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IPC IPC(8): C23F1/46C23F1/18
Inventor 赵伟宏史灿科罗忠凯
Owner 深圳市惠尔能科技有限公司
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