Process for recycling circuit board micro-etching waste liquid
A circuit board and micro-etching liquid technology, which is applied in the field of circuit board micro-etching waste liquid regeneration and recycling process, can solve the problems of increased operating costs, no waste liquid recycling treatment, low copper ion concentration, etc., and achieves a high degree of automatic control and maintenance. Convenience and economic benefits
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Embodiment 1-1
[0120] The making of embodiment 1-1 adsorbent
[0121] a) After measuring, mix well to form a mixed material, ball mill and pulverize the mixed material, put it into a tray, put it into a furnace, control the temperature at 145°C, keep it warm for 40 minutes, and then lower it to room temperature to obtain a sintered body;
[0122] b) The sintered body is coarsely crushed to obtain powder;
[0123] c) Pack the powder and store it for future use.
Embodiment 1-2
[0124] The making of embodiment 1-2 adsorbent
[0125] a) After measuring, mix well to form a mixed material, ball mill and pulverize the mixed material, put it into a tray, put it into a furnace, control the temperature at 155°C, keep it warm for 30 minutes, and then lower it to room temperature to obtain a sintered body;
[0126] b) The sintered body is coarsely crushed to obtain powder;
[0127] c) Pack the powder and store it for future use.
Embodiment 1-3
[0128] The making of embodiment 1-3 adsorbent
[0129] a) After measuring, mix well to form a mixed material, ball mill and pulverize the mixed material, put it into a tray, put it into a furnace, control the temperature at 150°C, keep it warm for 35 minutes, and then lower it to room temperature to obtain a sintered body;
[0130] b) The sintered body is coarsely crushed to obtain powder;
[0131] c) Pack the powder and store it for future use.
[0132] (11) Examples of chlorine and silver ion removal in the impurity removal tank.
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