Process for recycling circuit board micro-etching waste liquid
A circuit board and micro-etching liquid technology, which is applied in the field of circuit board micro-etching waste liquid regeneration and recycling process, can solve the problems of increased operating costs, no waste liquid recycling treatment, low copper ion concentration, etc., and achieves a high degree of automatic control and maintenance. Convenience and economic benefits
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[0120] Example 1-1 Preparation of adsorbent
[0121] a) After metering, mix well to form a mixture, ball mill and pulverize the mixture into the furnace, control the temperature at 145°C, keep it warm for 40 minutes, and then drop to room temperature to obtain a sintered body;
[0122] b) The sintered body is coarsely crushed to obtain powder;
[0123] c) The powder is packaged and stored for later use.
Example Embodiment
[0124] Example 1-2 Preparation of adsorbent
[0125] a) After measuring, mix well to form a mixture, ball mill and pulverize the mixture into the furnace, control the temperature at 155℃, keep it for 30 minutes, and then reduce to room temperature to obtain a sintered body;
[0126] b) The sintered body is coarsely crushed to obtain powder;
[0127] c) The powder is packaged and stored for later use.
Example Embodiment
[0128] Example 1-3 Preparation of adsorbent
[0129] a) After metering, mix well to form a mixture, ball mill and pulverize the mixture into the furnace, control the temperature at 150℃, keep it for 35 minutes, and then reduce to room temperature to obtain a sintered body;
[0130] b) The sintered body is coarsely crushed to obtain powder;
[0131] c) The powder is packaged and stored for later use.
[0132] (11) Examples of chlorine and silver ion removal in the impurity removal tank.
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