Surface palladium-plated bonding brass wire
A technology of bonding copper wire and palladium plating, which is applied in the field of bonding wire, can solve problems such as inability to guarantee the integrity of the plating layer, affect the quality of the plating layer, and damage the plating layer, achieve good final plastic deformation ability, improve breaking force and reliability , consistent deformation effect
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[0025] The present invention will be described below in conjunction with specific embodiments.
[0026] A palladium-plated bonding copper wire includes a copper core material with copper as the main component, and a palladium layer formed by plating on the copper core material. The copper core material with copper as the main component is added with trace metals to improve the elongation performance, and the copper core wire is drawn by single crystal smelting, and the surface is plated with palladium and then ultra-finely drawn to form a palladium-plated bonded copper wire.
[0027] The main component of the copper core material is a high-purity copper alloy material with a purity of 99.9988%. The 6N high-purity copper material is selected, and 5ppm calcium, 2.3ppm magnesium, 3ppm aluminum and 2.8ppm tin are added for single crystal smelting. In chemical analysis, the weight parts per million of its components are as follows:
[0028] Copper 99998.00×10 -6 ;
[0029] Iron 0.05×10 -6...
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