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electronic material composition

A technology for electronic materials and compositions, applied in the field of copper foil substrates and halogen-free electronic material compositions, can solve the problems of use restrictions, halogen residues, and high chlorine content in materials, and achieve small dissipation factors, low dielectric constants, and stable dimensions. Good properties and expansion coefficient

Active Publication Date: 2014-10-08
TAIWAN POWDER TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The patent I290945 previously proposed by Taiyao Technology is to use styrene-maleic anhydride copolymer (Styrene Maleic Anhydride Copolymer) with benzoxazine (Benzoxazine) and use phosphorus-containing epoxy resin to form high-frequency Halogen-free electronic materials, but due to the lack of selectivity of phosphorus-containing epoxy resins, the use will be limited
Moreover, there will be residual halogen "chlorine" when making epoxy resin, which often results in high chlorine content in the material

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0064] 100 parts by weight of oxo-nitrobenzocyclohexane, 50 parts by weight of styrene-maleic anhydride copolymer (SMA-3000), 40 parts by weight of silicon dioxide, 25 parts by weight of polymethylphosphonic acid 1,3-phenylene ester, 0.33 parts by weight of 2-methylimidazole and 70 parts by weight of methyl ethyl ketone were added into the stirrer.

Embodiment 2

[0066] With 100 parts by weight of oxoazinobenzocyclohexane, 10 parts by weight of styrene-maleic anhydride copolymer (SMA-3000), 40 parts by weight of silicon dioxide, 25 parts by weight of melamine pyrophosphate, 0.69 parts by weight of 2-methylimidazole and 70 parts by weight of methyl ethyl ketone were added into the stirrer.

Embodiment 3

[0068] With 100 parts by weight of oxoazinobenzocyclohexane, 45 parts by weight of styrene-maleic anhydride copolymer (SMA-3000), 40 parts by weight of aluminum hydroxide, 25 parts by weight of phosphazene flame retardant, 0.96 parts by weight of 2-methylimidazole and 70 parts by weight of methyl ethyl ketone were added into the stirrer.

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Abstract

The invention relates to a halogen-free electronic material composition which has the characteristics of low dielectric constant and small dissipation factor. The halogen-free electronic material composition comprises (a) styrene-maleic anhydride copolymer, (b) polybenzoxazine, (c) flame retardant and (d) additives. The electronic material composition can be used as a material of a high-frequency copper foil substrate.

Description

[0001] The technical field to which the invention belongs [0002] The present invention relates to an electronic material composition, especially a halogen-free electronic material composition with the characteristics of low dielectric constant (LowDielectric constant) and low dissipation factor (Low Dissipation factor), and the electronic material can be fabricated Applied to high-frequency copper foil substrates. Background technique [0003] The electronics industry traditionally regards the copper foil substrate material used as the supporting material for the installation of electronic components and circuit interconnection. The requirement for the copper foil substrate material is mainly to not affect the conductive function of the circuit. The requirements for copper foil substrate materials are no longer just the function of "support material". In the signal transmission of the circuit, system operators are also constantly demanding faster signal transmission time and...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C08L65/00C08L35/06C08K13/02C08K5/5399C08K3/32C08K5/52C08G61/12B32B15/08
Inventor 陈宪德廖志伟徐玄浩
Owner TAIWAN POWDER TECH CO LTD