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High-reliability soldering flux for aluminum soft soldering

A reliable and aluminum soldering technology, applied in the direction of welding medium, welding equipment, welding/cutting medium/material, etc., can solve the problems of unsatisfactory wettability, difficult discharge of solder joints, easy fall off of solder joints, etc., and achieve the goal of welding Fast speed, good wettability, not easy to fall off

Active Publication Date: 2013-02-06
SOLDERWELL MICROELECTRONIC PACKAGING MATERIALS CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, lead-free high-speed welding on aluminum alloys, especially aluminum alloys with high magnesium, silicon, and manganese content, has poor wettability. In addition, this kind of flux decomposes to produce a lot of gas, which is not easy to discharge in time in the solder joints, resulting in voids.
In a high-temperature and high-humidity environment, due to the acceleration of electrochemical and chemical corrosion and the expansion of gas in the cavity, the already fragile solder joints fall off, especially lead solder joints are easy to fall off

Method used

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  • High-reliability soldering flux for aluminum soft soldering

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Embodiment 1

[0017] Composition of the present invention and each component weight percentage are as follows:

[0018] Film remover: ethanolamine hydrofluoride 25%;

[0019] Metal salt: zinc fluoroborate 5%;

[0020] SnF 3%;

[0021] Activator: Diethanolamine 66.4%;

[0022] Surfactant: FSN-100 0.1%;

[0023] Corrosion inhibitor: 0.5% dodecylbenzimidazoline;

[0024] After the above components are mixed evenly, stir while heating. When the temperature rises to 130°C and no bubbles are generated, and the components are transparent and uniform, a light yellow solid product can be obtained.

Embodiment 2

[0026] Composition of the present invention and component weight percent are as follows:

[0027] Film remover: diethylamine hydrofluoride 30%;

[0028] Metal salt: zinc fluoroborate 7%;

[0029] SnF 1%;

[0030] Activator: Ethanolamine 20%;

[0031] Diethanolamine 41.5%;

[0032] Surfactant: FC-4430 0.1%;

[0033] Corrosion inhibitor: imidazoline 0.4%.

Embodiment 3

[0035] Composition of the present invention and component weight percent are as follows:

[0036] Film remover: dimethylamine hydrofluoride 27%;

[0037] Metal salt: zinc fluoroborate 6%;

[0038] SnF2 2%;

[0039] Activator: Diethanolamine 64.48%;

[0040] Surfactant: FC-4430 0.12%;

[0041] Corrosion inhibitor: Benzotriazole 0.4%.

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Abstract

The invention discloses a high-reliability soldering flux for aluminum soft soldering, which comprises the following components in percentage by weight: 15 to 30 percent of defoamer, 1 to 8 percent of metal salt, 30 to 70 percent of activating agent, 0.1 to 1 percent of surfactant and 0.1 to 2 percent of corrosion inhibitor. The high-reliability soldering flux is suitable to be prepared into core-spun tin wires together with an unleaded or lead soldering flux, and aluminum and an aluminum alloy are soldered automatically or manually. The soldering flux has short soldering time, high wettability, and high-temperature and high-humidity soldered spots with high tensile strength, is difficult to drop and belongs to an environment-friendly soldering flux. In addition, the high-reliability soldering flux is also suitable for the soft soldering of materials such as stainless steel, copper, copper alloy and the like.

Description

technical field [0001] The invention is a high-reliability flux for lead-free and lead-containing soldering of aluminum alloys in electrical appliances, instruments, communications, lighting and other electronic equipment. The flux of the present invention is also suitable for soldering of materials such as pure aluminum, stainless steel, copper and copper alloys. Background technique [0002] Aluminum and its alloys occupy a unique position among modern industrial materials due to their abundant reserves, low density, and high thermal and electrical conductivity (after Ag, Cu, and Au). In the manufacture of aircraft, automobiles, ships, electronic circuit boards, air-conditioning radiators, etc., in order to reduce weight, reduce energy consumption and cost, and enhance mobility, aluminum is used instead of copper as much as possible. [0003] There is a layer of extremely dense oxide film on the surface of aluminum and its alloys. The property of this layer of oxide film...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B23K35/362
Inventor 邓延陆雁陈明汉
Owner SOLDERWELL MICROELECTRONIC PACKAGING MATERIALS CO LTD