Manufacturing method of back contact battery in low ohmic contact
A back-contact battery and ohmic contact technology, applied in final product manufacturing, sustainable manufacturing/processing, circuits, etc., can solve the problems affecting conversion efficiency and high contact resistance, and achieve improved conversion efficiency, low production cost, and easy implementation. Effect
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[0016] Through the examples, the technical solution of the present invention is described in detail, but the protection scope of the present invention is not limited to the examples.
[0017] A method for manufacturing a low-ohm contact back-contact battery, comprising steps in sequence: testing and inspection of silicon wafers, pre-cleaning of silicon wafers, removing damaged layers, depositing SiN layers on one side, making small textured surfaces on one side, and silk screening on the side of the SiN film Print masking film, etch N on the side of SiN film + Layer window, front and back diffuse N at the same time + layer and form phosphosilicate glass barrier layer, remove SiN layer, P + layer diffuses and forms a passivating SiO 2 Layer thin film, screen printing lead hole masking film, etch lead hole while removing the front phosphosilicate glass and SiO 2 layer, evaporated titanium film, deposited SiN layer on the front, screen printed positive and negative electrodes,...
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