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Tin-silver-copper ternary alloy electroplating solution and electroplating method

A ternary alloy and tin-plating technology, which is applied in the chemical industry, can solve problems such as difficult production and maintenance, and achieve rapid and complete biodegradation, simple formula, and environmental protection.

Inactive Publication Date: 2011-08-24
CHANGCHUN UNIV OF TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Since a variety of complexing agents are used to coordinate tin, silver and copper respectively, the amount of various complexing agents used in actual operation needs to have a certain corresponding relationship, and the ratio of various complexing agents needs to be carefully maintained. This makes production maintenance difficult

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0057] Embodiment 1 (low-speed electroplating)

[0058] The bath composition is as follows:

[0059] Tin methanesulfonate 0.18mol / L

[0060] Silver methanesulfonate 0.005mol / L

[0061] Copper methanesulfonate 0.002mol / L

[0062] Hydroxyethylethylenediaminetriacetic acid (HEDTA) 0.8mol / L

[0063] Thiourea 0.03mol / L

[0064] Alkyl glycoside (APG) 0.003mol / L.

[0065] Plating solution preparation method:

[0066] After dissolving hydroxyethylethylenediaminetriacetic acid (HEDTA) and thiourea in deionized water, mix them with alkyl glycosides and stir evenly. Then add silver methanesulfonate, tin methanesulfonate and copper methanesulfonate respectively, and add deionized water to the required volume. Wherein the preparation method of silver methylsulfonate is: adopt methylsulfonic acid and silver oxide (Ag 2 O) reacting, the reaction temperature is 50-60° C., and the molar ratio of methanesulfonic acid to silver oxide is 5-6. Tin methanesulfonate and copper methanesulfon...

Embodiment 1--1

[0070] The bath composition is as follows:

[0071] Tin methanesulfonate 0.18mol / L

[0072] Silver methanesulfonate 0.005mol / L

[0073] Copper methanesulfonate 0.002mol / L

[0074] Hydroxyethylethylenediaminetriacetic acid (HEDTA) 0.8mol / L

[0075] Thiourea 0.03mol / L

[0076] Alkyl glycoside (APG) 0.003mol / L.

[0077] Plating solution preparation method:

[0078] After dissolving hydroxyethylethylenediaminetriacetic acid (HEDTA) and thiourea in deionized water, mix them with alkyl glycosides and stir evenly. Then add silver methanesulfonate, tin methanesulfonate and copper methanesulfonate respectively, and add deionized water to the required volume. Wherein the preparation method of silver methylsulfonate is: adopt methylsulfonic acid and silver oxide (Ag 2 O) reacting, the reaction temperature is 50-60° C., and the molar ratio of methanesulfonic acid to silver oxide is 5-6. Tin methanesulfonate and copper methanesulfonate are commercially available. Adjust the pH val...

Embodiment 1--2

[0082] The bath composition is as follows:

[0083] Tin methanesulfonate 0.18mol / L

[0084] Silver methanesulfonate 0.005mol / L

[0085] Copper methanesulfonate 0.002mol / L

[0086] Hydroxyethylethylenediaminetriacetic acid (HEDTA) 0.8mol / L

[0087] Thiourea 0.03mol / L

[0088] Alkyl glycoside (APG) 0.003mol / L.

[0089] Plating solution preparation method:

[0090] After dissolving hydroxyethylethylenediaminetriacetic acid (HEDTA) and thiourea in deionized water, mix them with alkyl glycosides and stir evenly. Then add silver methanesulfonate, tin methanesulfonate and copper methanesulfonate respectively, and add deionized water to the required volume. Wherein the preparation method of silver methylsulfonate is: adopt methylsulfonic acid and silver oxide (Ag 2 O) reacting, the reaction temperature is 50-60° C., and the molar ratio of methanesulfonic acid to silver oxide is 5-6. Tin methanesulfonate and copper methanesulfonate are commercially available. Adjust the pH val...

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PUM

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Abstract

The invention discloses a tin-silver-copper ternary alloy electroplating solution, belonging to the field of chemical industry and relating to a tin-silver-copper electroplating solution and electroplating method. The invention aims to provide a tin-silver-copper ternary alloy electroplating solution which does not contain harmful substance phosphorous compounds and is used for electroplating tin-silver-copper ternary alloy, and provide an electroplating method. The electroplating solution provided by the invention is prepared from tin methyl sulfonate, silver methyl sulfonate, copper methyl sulfonate, complexing agents, auxiliary complexing agents and additives. The electroplating solution provided by the invention has a simple formula and is easy to operate and maintain, and chemicals harmful to the environment are not used. A single organic complexing agent system is adopted, thus the electroplating solution has a simple formula and is easy to operate and maintain; phosphorous complexing agents are not used, thus being favorable for environment protection; and in addition, the additive alkyl glycoside used in the invention belongs to environment-friendly non-ionic surfactants, thus the biological degradation is rapid and thorough.

Description

technical field [0001] The invention belongs to the field of chemical industry and relates to a plating solution and an electroplating method for electroplating tin, silver and copper. Background technique [0002] Due to the requirements of environmental protection, the solderable coating widely used in the electronics industry has changed from tin-lead to pure tin or tin-based alloys. The tin-silver-copper ternary alloy coating has good solderability and good ability to suppress tin whiskers, so it has a good application prospect. [0003] The composition of the tin-silver-copper ternary electroplating solution mainly contains metal ions of tin, silver and copper, and at the same time, in order to achieve co-deposition of tin, silver and copper, it must contain appropriate complexing agents and additives. US2007 / 0297937 A1 and EP1826295 A1 disclose a method using polymeric phosphate and porphyrin as complexing agents and polyethylene glycol as additives; US2005 / 0184369 A1...

Claims

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Application Information

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IPC IPC(8): C25D3/60
Inventor 贺岩峰石秀敏尹丽马立国
Owner CHANGCHUN UNIV OF TECH
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