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Manufacturing method of carbon nano-tube micro-channel cooler system

A technology of carbon nanotubes and microchannels, applied in nanostructure manufacturing, nanotechnology, nanotechnology, etc., can solve the problems of low heat dissipation performance of coolers and inability to meet the heat dissipation requirements of high-density integrated circuits

Inactive Publication Date: 2013-04-03
SHANGHAI UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0004] The present invention is aimed at the fact that the heat dissipation performance of conventional microchannel coolers is not high enough to meet the heat dissipation requirements of high-density integrated circuits.

Method used

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  • Manufacturing method of carbon nano-tube micro-channel cooler system
  • Manufacturing method of carbon nano-tube micro-channel cooler system
  • Manufacturing method of carbon nano-tube micro-channel cooler system

Examples

Experimental program
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Embodiment 1

[0022] In this embodiment, the above method for preparing a carbon nanotube microchannel cooler is adopted, and the specific steps are as follows:

[0023] 1 Spin-coat a layer of peeling glue on the silicon wafer. After heating this layer of peeling glue, spin-coat a layer of standard positive photoresist on it. After 30 seconds of UV exposure and 45 seconds of MF319 development, the peeling glue is formed Undercut structure, use evaporation process to cover a layer of catalyst film on the entire surface, and then put the silicon wafer in the photoresist remover, peel off the stripper, photoresist and the catalyst film attached to the photoresist, and finally A catalyst pattern with the same pattern as the photolithography mask is formed on the silicon wafer, and the catalyst film is composed of 10 nanometers thick aluminum oxide and 1 nanometer thick iron;

[0024] 2 Place the silicon wafer with the catalyst pattern in the quartz tube, vacuum the quartz tube, and then pass it to 9...

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Abstract

Disclosed is a microchannel cooler for an integrated circuit chip (20) comprising an integrated circuit chip (20) and a microchannel cooler located on the surface of the integrated circuit chip (20), with the microchannel cooler being a carbon nanotube array (14) bonded on the surface of the integrated circuit chip (20), the carbon nanotube array (14) being sealed off by a sealing cap (21), a plurality of microchannels being provided in the carbon nanotube array (14), and an inlet and an outlet for a cooling fluid being provided at two ends of the sealing cap (21). Also disclosed is a method for manufacturing the cooler, which method includes the step of growing carbon nanotubes on a silicon substrate (10), the step of mounting the carbon nanotubes in an inverted manner to the surface of the integrated circuit chip (20), and the step of sealing the carbon nanotubes. Because the microchannels are formed by the carbon nanotubes, and the carbon nanotubes are directly bonded to the surface of the integrated circuit chip (20), the efficiency of heat dissipation is improved, and this affects the overall height of the integrated circuit chip (20) very little, thereby being advantageous for improving the level of integration and for reducing the overall external appearance of height.

Description

technical field [0001] The invention relates to a carbon nanotube microchannel cooler system used for heat dissipation of VLSI chips, and belongs to the technical field of microchannel heat dissipation. Background technique [0002] The development of high-density integrated circuit (IC) technology, while improving the function of IC, also brings the challenge of high heat flux density. At present, the power of high-density IC has reached 100-400 W / cm 2 . Therefore, it is very important to study the heat dissipation of high-power ICs. [0003] Microchannel coolers are an emerging technology for efficient heat dissipation in microelectronic systems. With this technology, the microchannel is directly fabricated on the back of the chip, and the heat generated by the circuit is taken away by the cooling medium flowing through the microchannel. [0004] The present invention is aimed at the fact that the current conventional micro-channel coolers have low heat dissipation per...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L21/48B82B3/00H01L23/473
CPCB82Y10/00H01L23/373H01L23/473H01L2924/0002
Inventor 刘建影
Owner SHANGHAI UNIV
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