Diamond-containing composite material and preparation method thereof
A composite material and diamond technology, which is applied in the field of composite materials containing diamond and its preparation, can solve the problems of limited application range, small material size, complicated equipment, etc., and achieves simple and easy preparation process, low sintering temperature, and thermal conductivity. high effect
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[0022] In a typical implementation of the present invention, a method for preparing a diamond-containing composite material is provided. The preparation method includes the following steps: adding diamond powder and carbon powder to a liquid organic material with a certain viscosity and mixing uniformly to form a mixed material. Slurry A is solidified and ground into powder B with uniform particles; powder B is hot-molded to obtain a green body; in a gas-phase silicon environment (or in an environment with silicon powder preset), high-temperature sintering The green body, the silicon element penetrates into the green body and reacts with the carbon element in the green body to form silicon carbide, and a composite material containing diamond is obtained. The viscosity of the above-mentioned organic materials does not have too many requirements, as long as the diamond powder and carbon powder can be bonded on the organic materials.
[0023] The preparation method of the diamond...
specific Embodiment 1-3
[0031] The beneficial effects of the diamond-containing composite material of the present invention will be further illustrated below in conjunction with specific examples 1-3 and the test structures of samples 1-3 prepared from examples 1-3.
Embodiment 1
[0033] Raw materials: 80Kg of diamond powder, 10Kg of graphite powder and 10Kg of liquid phenolic resin (Xi'an Taihang Fire-retardant Polymer Research Institute, RFB grade).
[0034] Production method: put diamond powder and graphite powder into liquid phenolic resin and ball mill for 20 hours to obtain mixed slurry A, which is solidified and ground into uniform mixed powder B, so that mixed powder B contains 80wt% diamond and 10wt% Graphite, 10wt% phenolic resin. ; The mixed powder B was hot-molded under the conditions of molding temperature 150°C and molding pressure 10MPa to obtain a biscuit; the biscuit was placed in a high-temperature vacuum furnace with gas-phase silicon, and the sintering temperature was controlled to be 1600°C. 200Pa, the silicon element penetrates into the green body and reacts with the carbon element in the green body to form silicon carbide, and heats it for 6 hours to obtain the diamond-containing composite material sample 1 of the present inventio...
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