Metal foil with electric resistance film and method for manufacturing the metal foil
A manufacturing method, metal foil technology, applied in the direction of printed circuit manufacturing, including printed resistors, metal layered products, etc., can solve the problem of not forming a variety of resistance films, etc., and achieve the reduction and improvement of the number of installed parts or soldering Signal characteristics, effects of spatial expansion
Inactive Publication Date: 2011-09-07
JX NIPPON MINING & METALS CORP
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- Description
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- Application Information
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Problems solved by technology
[0006] However, at present, only a specific resistance film is formed on a metal foil, and there is no idea of forming a variety of resistance films.
Method used
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Embodiment Construction
[0050] The structure of the conventional resistance built-in copper foil is shown in figure 1 . 1a is the built-in thin film resistor, and 1b is the copper foil of the base. The thin film resistor of 1a is produced by sputtering the surface of the copper foil while winding it using NiCr or the like.
[0051] figure 2 and image 3 It is an explanatory drawing showing the manufacturing example of the conventional resistor built-in copper foil. figure 2 , the copper foil 2c wound on the unwinding roll of 2b is wound up on the take-up roll 2a via the rotating cooling drum 2d.
[0052] Argon gas was introduced into the vacuum chamber 2e to maintain the pressure at about 0.4 Pa. Next, when a high voltage is applied to the cathode 2f, it will be in a plasma state, and the target material 2g will fly out and be sputtered on the copper foil.
[0053] image 3 2f is a cathode, 2g is a target, 2c is a copper foil, and the arrow shows the winding direction of copper foil.
[005...
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Abstract
A copper foil with an electric resistance film in which a film with higher electrical resistivity than the metal foil is provided on the metal foil, wherein a plurality of electric resistance films with different electric resistance is arranged in parallel on the same metal foil. With conventionally used built-in resistor elements, one resistor element is configured of one type of substance on the copper foil. Nevertheless, when actually mounting the resistor elements, the circuit design tolerance can be increased and the number of man-hours can be reduced with two resistor elements and further with a plurality of resistor elements compared to a case with one resistor element. This invention aims to provide a metal foil with a built-in resistor element comprising two or more types of resistor elements on one metal foil.
Description
technical field [0001] Most electronic devices are composed of a mixture of components with different functions. In recent years, these electronic devices have also been required to be smaller and lighter in terms of mounting, and efficient arrangement of components to cope with reduction in substrate area and increase in size of active devices is required. In recent years, thin film resistors have been used especially when mounting these components. The present invention relates to a metal foil with a resistive film formed by forming a resistive film on the metal foil. Background technique [0002] Copper foil is generally used as a wiring material of a printed circuit board. The copper foil is classified into an electrolytic copper foil and a rolled copper foil according to its manufacturing method. The copper foil can be arbitrarily adjusted from a very thin copper foil with a thickness of 5 μm to a thick copper foil of about 140 μm. [0003] The copper foil described...
Claims
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IPC IPC(8): B32B15/04B32B7/02C23C14/14
CPCC23C14/542C23C14/04H05K1/167C23C14/165H05K2203/0361C23C14/08H05K2201/0355C23C14/562H05K2201/0391C23C14/044Y10T428/12493
Inventor 大坂重雄黑泽俊雄夏目隆
Owner JX NIPPON MINING & METALS CORP