Producing method of overlay ceramic electronic component

A manufacturing method and technology of electronic components, applied in fixed capacitor parts, laminated capacitors, fixed capacitor electrodes, etc., can solve problems such as poor short circuit, erosion, and reduced coverage of internal electrodes, and achieve high reliability and coverage High, no bad effect of short circuit
CN102201285AInactive Publication Date: 2011-09-28MURATA MFG CO LTD
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Patent Information

Authority / Receiving Office
CN · China
Current Assignee / Owner
MURATA MFG CO LTD
Publication Date
2011-09-28
Estimated Expiration
Not applicable · inactive patent

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Abstract

The invention provides a producing method of an overlay ceramic electronic component, which can prevent internal electrode patterns from erosion by solvents in ceramic slurry when ceramic raw slices are formed by coating ceramic slurry, is free of problems like reduced coverage rate and short circuit of internal electrodes, and can really manufacture overlay ceramic electronic components with high reliability. Each time when internal electrode patterns (3a, 3b) contacting with the ceramic slurry are formed, internal electrode slurry having solidifying resin and conductive components is adopted according to a manner enabling the slurry to become regulated patterns, and the solidifying resin is solidified.
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Description

technical field

[0001] The present invention relates to a method of manufacturing a laminated ceramic electronic component manufactured through the steps of forming a ceramic green sheet by applying a ceramic slurry and applying an internal electrode paste in a predetermined pattern. Internal electrode patterns are formed. Background technique

[0002] As one of the methods of manufacturing laminated ceramic electronic components having a structure in which ceramic layers and internal electrode layers are alternately laminated such as laminated ceramic capacitors, it has been proposed to laminate lower green sheets (lower ceramic green sheets) and form A method of manufacturing a laminated electronic component by forming a green chip (green chip) by forming a laminate unit including an internal electrode pattern layer on it, and firing the green chip (Patent Document 1).

[0003] Furthermore, Patent Document 1 discloses that after curing the lower green sheet containing a c...

Claims

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