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Nickel-copper conductive paste for electronic component electrode and manufacturing technology thereof

A technology for conductive paste and electronic components, which is used in cable/conductor manufacturing, electrical components, conductive materials dispersed in non-conductive inorganic materials, etc. It can solve the problem of insufficient adhesion and achieve the effect of improving adhesion.

Inactive Publication Date: 2011-10-05
SHENZHEN SENLONT ELECTRONICS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In this application, pure copper conductor paste has been produced and applied by some companies at home and abroad, but pure copper conductor paste has inherent shortcomings, especially when it is sintered with functional ceramics, the mutual adhesion is not high enough, and it has long been used by electronic Component manufacturing factories worry about

Method used

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  • Nickel-copper conductive paste for electronic component electrode and manufacturing technology thereof
  • Nickel-copper conductive paste for electronic component electrode and manufacturing technology thereof

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Embodiment Construction

[0021] The following describes the nickel-copper conductor paste and its manufacturing process described in the application of the present invention through specific implementation methods, the purpose is for the public to better understand the technical content described in the application of the present invention, not to limit the technical content , in fact, within the spirit of the present invention, the improvements to the process formula, including the increase, decrease and replacement of the corresponding components, can be obtained by those of ordinary skill in the art without creative work, so they are all included in this Within the technical solution claimed in the invention application.

[0022] Here is an example to illustrate the production of nickel-copper conductor paste for electrodes of electronic components. The actual materials used are as follows:

[0023] The preparation of the mixed nickel-copper powder is according to the ratio in Table 1. Accurately w...

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Abstract

The invention provides nickel-copper conductive paste which comprises the following components in percent by weight: 50 to 80% (wt) of nickel-copper mixed powder, 2 to 5% (wt) of glass powder, 3 to 10% (wt) of inorganic packing powder and 15 to 35% (wt) of organic carrier, wherein the total percentage of all the components is 100%. Compared with the pure copper conductive paste, the nickel-copper conductive paste has ensures that adhesive force of a nickel-copper conductive film generated by the nickel-copper conductive paste is increased; compared with the pure nickel conductive paste, the nickel-copper conductive paste ensures that the nickel-copper conductive film generated by the nickel-copper conductor paste has weldability; and a mixture of cheap metallic nickel and copper is used for replacing noble metal silver or silver-palladium alloy to serve as an electrode of the electronic element, thus the nickel-copper conductive paste has obvious advantages in economic aspects.

Description

technical field [0001] The application of the present invention relates to a conductor paste, in particular to a nickel-copper conductor paste for ceramic electronic components and electrodes of surface-mounted electronic components and a manufacturing process thereof. Background technique [0002] Conductive paste is a thick film paste used as a conductor in microelectronics technology. Common conductive pastes are divided into silver-based pastes, gold-based pastes and ternary noble metal conductive pastes. It is generally required to have a certain viscosity and thixotropy, good electrical conductivity of the fired film, small signal attenuation, good compatibility with thick film resistors, low diffusion speed of the conductive phase, full tin coating, good solderability and resistance to solder erosion Good performance, high bond fastness with the substrate, high stability and reliability. It is widely used in the production of conductive strips for hybrid integrated c...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01B1/22H01B13/00
Inventor 叶志龙周作文胡教军
Owner SHENZHEN SENLONT ELECTRONICS
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