Substrate used in luminescent device and preparation method thereof
A technology for light-emitting devices and substrates, which is used in the manufacture of semiconductor/solid-state devices, electric solid-state devices, semiconductor devices, etc., and can solve the problems of poor surface flatness of thin-layer carbon nanotubes, poor bonding force between carbon nanotubes and flexible substrates, etc. , to achieve the effect of enhancing luminous intensity, high visible light transmittance, and improving flatness
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Embodiment 1
[0095] Such as figure 1 As shown in the substrate structure, the flexible substrate 1 adopts a free radical type ultraviolet light curing adhesive, and the free radical type ultraviolet light curing adhesive includes 95% of base resin, 2% of monomer, 2% of photoinitiator and 1% of photosensitizer and auxiliary agent, the conductive layer 2 adopts carbon nanotubes, the gaps of the carbon nanotube layer are filled with inorganic luminescent nanoparticles, the size of the inorganic luminescent nanoparticles is 10 nanometers, and the thickness of the carbon nanotube layer is 80nm .
[0096] The preparation method is as follows:
[0097] ① Clean the silicon substrate whose surface roughness is less than 1nm, and dry it with dry nitrogen after cleaning;
[0098] ② Disperse carbon nanotubes evenly in a solvent, and prepare a carbon nanotube layer on a clean silicon substrate by spin coating. The rotation speed of spin coating is 4000 rpm, the duration is 60 seconds, and the film th...
Embodiment 2
[0104] Such as figure 1 As shown in the substrate structure, the flexible substrate 1 adopts a free radical type ultraviolet light curing adhesive, and the free radical type ultraviolet light curing adhesive includes 99.5% of base resin, 0.2% of monomer, 0.2% of photoinitiator and 0.1% of Photosensitizer and auxiliary agent, carbon nanotubes are used in the conductive layer 2, inorganic luminescent nanoparticles are filled in the gaps of the carbon nanotube layer, the size of the inorganic luminescent nanoparticles is 8 nanometers, and the thickness of the carbon nanotube layer is 70nm .
[0105] The preparation method is similar to Example 1.
Embodiment 3
[0107] Such as figure 1 As shown in the substrate structure, the flexible substrate 1 adopts a free radical type ultraviolet light curing adhesive, and the free radical type ultraviolet light curing adhesive includes 90% of the base resin, 2% of the monomer, 2% of the photoinitiator and 6% of the Photosensitizer and auxiliary agent, the conductive layer 2 adopts carbon nanotubes, the gaps of the carbon nanotube layer are filled with inorganic luminescent nanoparticles, the size of the inorganic luminescent nanoparticles is 5 nanometers, and the thickness of the carbon nanotube layer is 60nm .
[0108] The preparation method is similar to Example 1.
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Abstract
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