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Substrate used in luminescent device and preparation method thereof

A technology for light-emitting devices and substrates, which is used in the manufacture of semiconductor/solid-state devices, electric solid-state devices, semiconductor devices, etc., and can solve the problems of poor surface flatness of thin-layer carbon nanotubes, poor bonding force between carbon nanotubes and flexible substrates, etc. , to achieve the effect of enhancing luminous intensity, high visible light transmittance, and improving flatness

Inactive Publication Date: 2011-10-05
UNIV OF ELECTRONICS SCI & TECH OF CHINA
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0008] The technical problem to be solved by the present invention is how to provide a substrate for flexible light-emitting devices and its preparation method. The substrate solves the problems of poor surface flatness of thin-layer carbon nanotubes and poor bonding force between carbon nanotubes and flexible substrates. , improve the conductivity of the conductive layer and the barrier ability of the substrate to water and oxygen

Method used

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  • Substrate used in luminescent device and preparation method thereof
  • Substrate used in luminescent device and preparation method thereof
  • Substrate used in luminescent device and preparation method thereof

Examples

Experimental program
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Effect test

Embodiment 1

[0095] Such as figure 1 As shown in the substrate structure, the flexible substrate 1 adopts a free radical type ultraviolet light curing adhesive, and the free radical type ultraviolet light curing adhesive includes 95% of base resin, 2% of monomer, 2% of photoinitiator and 1% of photosensitizer and auxiliary agent, the conductive layer 2 adopts carbon nanotubes, the gaps of the carbon nanotube layer are filled with inorganic luminescent nanoparticles, the size of the inorganic luminescent nanoparticles is 10 nanometers, and the thickness of the carbon nanotube layer is 80nm .

[0096] The preparation method is as follows:

[0097] ① Clean the silicon substrate whose surface roughness is less than 1nm, and dry it with dry nitrogen after cleaning;

[0098] ② Disperse carbon nanotubes evenly in a solvent, and prepare a carbon nanotube layer on a clean silicon substrate by spin coating. The rotation speed of spin coating is 4000 rpm, the duration is 60 seconds, and the film th...

Embodiment 2

[0104] Such as figure 1 As shown in the substrate structure, the flexible substrate 1 adopts a free radical type ultraviolet light curing adhesive, and the free radical type ultraviolet light curing adhesive includes 99.5% of base resin, 0.2% of monomer, 0.2% of photoinitiator and 0.1% of Photosensitizer and auxiliary agent, carbon nanotubes are used in the conductive layer 2, inorganic luminescent nanoparticles are filled in the gaps of the carbon nanotube layer, the size of the inorganic luminescent nanoparticles is 8 nanometers, and the thickness of the carbon nanotube layer is 70nm .

[0105] The preparation method is similar to Example 1.

Embodiment 3

[0107] Such as figure 1 As shown in the substrate structure, the flexible substrate 1 adopts a free radical type ultraviolet light curing adhesive, and the free radical type ultraviolet light curing adhesive includes 90% of the base resin, 2% of the monomer, 2% of the photoinitiator and 6% of the Photosensitizer and auxiliary agent, the conductive layer 2 adopts carbon nanotubes, the gaps of the carbon nanotube layer are filled with inorganic luminescent nanoparticles, the size of the inorganic luminescent nanoparticles is 5 nanometers, and the thickness of the carbon nanotube layer is 60nm .

[0108] The preparation method is similar to Example 1.

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Abstract

The invention discloses a substrate used in a luminescent device. The substrate comprises a flexible substrate base and a conducting layer. The flexible substrate base and the conducting layer are composed in one of the following two manners: 1, the flexible substrate base is an ultraviolet light solidification adhesive, the conducting layer is a thin layer of carbon nanotubes, and the gap of thethin layer of carbon nanotubes is filled with inorganic luminescent nanometer particles; 2, the flexible substrate base is an ultraviolet light solidification adhesive doped with inorganic luminescent nanometer particles, the conducting layer is a thin layer carbon nanotube, the gap of the thin layer carbon nanotube is filled with an ultraviolet light solidification adhesive doped with inorganic luminescent nanometer particles, and the ultraviolet light solidification adhesive comprises a free radical type ultraviolet light solidification adhesive, a cationoid ultraviolet light solidificationadhesive and their mixing system. According to the substrate, the problems that the surface flatness of the thin layer of carbon nanotubes is bad and the bonding force between the conducting layer and the flexible substrate base is small are solved, the conductivity of the conducting layer and the obstruction capability of the substrate against water and oxygen are improved.

Description

technical field [0001] The invention relates to the technical field of organic optoelectronics, in particular to a substrate for a flexible light-emitting device and a preparation method thereof. Background technique [0002] Optoelectronics technology is a rapidly developing industry with high technological content after microelectronics technology. With the rapid development of optoelectronic technology, optoelectronic products such as solar cells, optical image sensors, flat panel displays, and thin film transistors have gradually matured, and they have greatly improved people's lives. At the same time, the wide application of optoelectronic information technology in various fields of social life has also created a huge growing market. Developed countries regard the optoelectronic information industry as one of the key development areas, and the competition in the optoelectronic information field is unfolding worldwide. [0003] Optoelectronics technology is a rapidly d...

Claims

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Application Information

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IPC IPC(8): C09J4/00H01L51/56C09J163/00C09J167/06H01L51/54H01L51/52
Inventor 于军胜马柱李璐蒋亚东
Owner UNIV OF ELECTRONICS SCI & TECH OF CHINA