Substrate used by flexible light-emitting device and preparation method thereof
A technology for light-emitting devices and rigid substrates, applied in the field of substrates for flexible light-emitting devices and their preparation, can solve the problems of poor bonding force and large roughness of silver nanowire films, and achieves increased bonding force, high visible light transmittance, enhanced The effect of luminous intensity
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Embodiment 1
[0095] Such as figure 1 As shown in the substrate structure, the flexible substrate 1 adopts a free radical type ultraviolet light curing adhesive, and the free radical type ultraviolet light curing adhesive includes 94% of base resin, 1% of monomer, 1% of photoinitiator and 4% of Photosensitizer and auxiliary agent, the conductive layer 2 adopts silver nanowire thin film, and organic luminescent material is filled in the gap of the silver nanowire thin film.
[0096] The preparation method is as follows:
[0097] ① Clean the silicon substrate whose surface roughness is less than 1nm, and dry it with dry nitrogen after cleaning;
[0098] ② Disperse the silver nanowires evenly in the solvent, and prepare the silver nanowire film on the clean silicon substrate by spin coating. The rotation speed of the spin coating is 4000 rpm, the duration is 60 seconds, and the film thickness is about 80 nanometers;
[0099] ③Spray a solution containing organic light-emitting materials on th...
Embodiment 2
[0104] Such as figure 1 As shown in the substrate structure, the flexible substrate 1 adopts a free radical type ultraviolet light curing adhesive, and the free radical type ultraviolet light curing adhesive includes 99.5% of base resin, 0.2% of monomer, 0.2% of photoinitiator and 0.1% of Photosensitizer and auxiliary agent, the conductive layer 2 adopts silver nanowire thin film, and organic luminescent material is filled in the gap of the silver nanowire thin film.
[0105] Preparation method is familiar with embodiment 1.
Embodiment 3
[0107] Such as figure 1 As shown in the substrate structure, the flexible substrate 1 adopts a free radical type ultraviolet light curing adhesive, and the free radical type ultraviolet light curing adhesive includes 91% of base resin, 1% of monomer, 2% of photoinitiator and 6% of Photosensitizer and auxiliary agent, the conductive layer 2 adopts silver nanowire thin film, and organic luminescent material is filled in the gap of the silver nanowire thin film.
[0108] Preparation method is familiar with embodiment 1.
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Abstract
Description
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