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Substrate used by flexible light-emitting device and preparation method thereof

A technology for light-emitting devices and rigid substrates, applied in the field of substrates for flexible light-emitting devices and their preparation, can solve the problems of poor bonding force and large roughness of silver nanowire films, and achieves increased bonding force, high visible light transmittance, enhanced The effect of luminous intensity

Inactive Publication Date: 2013-03-27
UNIV OF ELECTRONICS SCI & TECH OF CHINA
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0007] The problem to be solved by the present invention is: how to provide a substrate for a flexible light-emitting device and its preparation method, the substrate solves the problems of large roughness of the silver nanowire film and poor bonding force between the silver nanowire film and the flexible substrate, Improve the flatness of the silver nanowire film surface and the bonding force between the silver nanowire film and the flexible substrate

Method used

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  • Substrate used by flexible light-emitting device and preparation method thereof
  • Substrate used by flexible light-emitting device and preparation method thereof
  • Substrate used by flexible light-emitting device and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0095] Such as figure 1 As shown in the substrate structure, the flexible substrate 1 adopts a free radical type ultraviolet light curing adhesive, and the free radical type ultraviolet light curing adhesive includes 94% of base resin, 1% of monomer, 1% of photoinitiator and 4% of Photosensitizer and auxiliary agent, the conductive layer 2 adopts silver nanowire thin film, and organic luminescent material is filled in the gap of the silver nanowire thin film.

[0096] The preparation method is as follows:

[0097] ① Clean the silicon substrate whose surface roughness is less than 1nm, and dry it with dry nitrogen after cleaning;

[0098] ② Disperse the silver nanowires evenly in the solvent, and prepare the silver nanowire film on the clean silicon substrate by spin coating. The rotation speed of the spin coating is 4000 rpm, the duration is 60 seconds, and the film thickness is about 80 nanometers;

[0099] ③Spray a solution containing organic light-emitting materials on th...

Embodiment 2

[0104] Such as figure 1 As shown in the substrate structure, the flexible substrate 1 adopts a free radical type ultraviolet light curing adhesive, and the free radical type ultraviolet light curing adhesive includes 99.5% of base resin, 0.2% of monomer, 0.2% of photoinitiator and 0.1% of Photosensitizer and auxiliary agent, the conductive layer 2 adopts silver nanowire thin film, and organic luminescent material is filled in the gap of the silver nanowire thin film.

[0105] Preparation method is familiar with embodiment 1.

Embodiment 3

[0107] Such as figure 1 As shown in the substrate structure, the flexible substrate 1 adopts a free radical type ultraviolet light curing adhesive, and the free radical type ultraviolet light curing adhesive includes 91% of base resin, 1% of monomer, 2% of photoinitiator and 6% of Photosensitizer and auxiliary agent, the conductive layer 2 adopts silver nanowire thin film, and organic luminescent material is filled in the gap of the silver nanowire thin film.

[0108] Preparation method is familiar with embodiment 1.

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Abstract

The invention discloses a substrate used by a flexible light-emitting device. The substrate comprises a flexible substrate and a conducting layer. The flexible substrate and the conducting layer are composed in one manner of the following two manners: (1), the flexible substrate is composed of an ultraviolet curing adhesive, the conducting layer is composed of a silver nanowire film, and the gap of the silver nanowire film is filled with an organic luminescent material; (2), the flexible substrate is composed of an ultraviolet curing adhesive blended with an organic luminescent material, and the conducting layer is composed of a silver nanowire film, and the gap of the silver nanowire film is filled with an ultraviolet curing adhesive blended with an organic luminescent material, wherein the ultraviolet curing adhesive includes a free radical type ultraviolet curing adhesive, a cationic ultraviolet curing adhesive, and a mixed system of the free radical type ultraviolet curing adhesive and the cationic ultraviolet curing adhesive. According to the substrate used by flexible light-emitting device provide in the invention, the problems that the roughness of the silver nanowire film is large and the bonding force between the silver nanowire film and the flexible substrate is poor are solved; Therefore, the flatness of the surface of the silver nanowire film is improved, and the bonding force between the silver nanowire film and the flexible substrate is strengthened.

Description

technical field [0001] The invention relates to the technical field of organic optoelectronics, in particular to a substrate for a flexible light-emitting device and a preparation method thereof. Background technique [0002] Optoelectronics technology is a rapidly developing industry with high technological content after microelectronics technology. With the rapid development of optoelectronic technology, optoelectronic products such as solar cells, optical image sensors, flat panel displays, and thin film transistors have gradually matured, and they have greatly improved people's lives. At the same time, the wide application of optoelectronic information technology in various fields of social life has also created a huge growing market. Developed countries regard the optoelectronic information industry as one of the key development areas, and the competition in the optoelectronic information field is unfolding worldwide. [0003] At present, organic optoelectronic device...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L51/52H01L51/54C09J167/06C09J4/00C09J163/00C09J9/00H01L51/56
Inventor 于军胜赵娟刘胜强蒋亚东
Owner UNIV OF ELECTRONICS SCI & TECH OF CHINA