Solder for bonding C/SiC composite material with Ni-based alloy and bonding method

A technology of composite materials and base alloys, which is applied in the field of connection between carbon/silicon carbide ceramic matrix composites and nickel-based superalloys, can solve problems such as the influence of joint strength, improve room temperature bending strength, reduce mismatch, Effect of Reducing Residual Thermal Stress

Active Publication Date: 2011-10-19
NORTHWESTERN POLYTECHNICAL UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0007] In order to overcome the deficiency that the solder composition and the thermal expansion coefficient mismatch between the base material and the residual stress in the prior art will affect the strength of the joint, the present invention proposes a method for connecting C / SiC composite material and Ni-based Alloy Solder and Joining Method

Method used

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Examples

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Comparison scheme
Effect test

Embodiment 1

[0017] This embodiment is a method for connecting a carbon / silicon carbide ceramic matrix composite material and a nickel-based superalloy. The Ni-based alloy involved is GH783, the C / SiC composite material involved is a 2D C / SiC composite material with an open porosity of 20%, and the connection area is 4mm×5mm. Cu foil with a thickness of 40 μm, Ti foil with a thickness of 80 μm and Mo powder with a particle size of 5 μm were selected as solders. The total mass of solder is 0.095g, wherein the mass fraction of Cu foil is 78%, the mass fraction of Ti foil is 12%, and the mass fraction of Mo powder is 10%. The stated mass fraction is the mass fraction of solder.

[0018] The specific process of this embodiment includes the following steps:

[0019] Step 1, removing impurities on the joint surface of the Ni-based alloy GH783 and the 2D C / SiC composite material. The connection surface of the Ni-based alloy was polished with 800 mesh sandpaper, and the connection surface of th...

Embodiment 2

[0026] This embodiment is a method for connecting a carbon / silicon carbide ceramic matrix composite material and a nickel-based superalloy. The Ni-based alloy involved is GH4169, the C / SiC composite material involved is a 2.5D C / SiC composite material with an open porosity of 18%, and the connection area is 4mm×5mm. Select Cu foil with a thickness of 50 μm, Ti foil with a thickness of 100 μm and Mo powder with a particle size of 10 μm as solder, the total mass of solder is 0.102 g, the mass fraction of Cu foil is 72.5%, and the mass fraction of Ti foil is The fraction is 9%, and the mass fraction of Mo powder is 18.5%; the stated mass fraction is the mass fraction of solder. The specific process of this embodiment includes the following steps:

[0027] Step 1, removing impurities on the joint surface of the Ni-based alloy GH4169 and the 2.5D C / SiC composite material. The connection surface of the Ni-based alloy was polished with 800 mesh sandpaper, and the connection surface...

Embodiment 3

[0034] This embodiment is a method for connecting a carbon / silicon carbide ceramic matrix composite material and a nickel-based superalloy. The Ni-based alloy involved is GH3128, the C / SiC composite material involved is a 3D C / SiC composite material with an open porosity of 16%, and the connection area is 4mm×5mm. Select Cu foil with a thickness of 60 μm, Ti foil with a thickness of 90 μm and Mo powder with a particle size of 7 μm as the solder, the total mass of the solder is 0.108g, the mass fraction of Cu foil is 73%, the mass fraction of Ti foil The fraction is 12%, and the mass fraction of Mo powder is 15%; the stated mass fraction is the mass fraction of solder. The specific process of this embodiment includes the following steps:

[0035] Step 1, removing impurities on the joint surface of the Ni-based alloy GH3128 and the 3D C / SiC composite material. The connection surface of the Ni-based alloy was polished with 800 mesh sandpaper, and the connection surface of the 3...

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Abstract

The invention discloses a solder for bonding a C/SiC composite material with a Ni-based alloy and a bonding method. The solder is composed of 67-78% of Cu foil by mass, 8.5-15% of Ti foil by mass and 10-24.5% of Mo powder by mass. The thickness of the Cu foil is 30-70 mum. The thickness of the Ti foil is 80-120 mum. The granularity of the Mo powder is 3-15 mum. By pretreating the solder, the cleaned Cu foil, the cleaned Ti foil and the Mo powder paste can be obtained. A pre-bonded element is manufactured by using the solder. A bonding piece between a carbon/silicon carbide ceramic-based composite material and a nickel-based high-temperature alloy can be obtained through hot pressing. According to the solder disclosed by the invention, the mismatching property of thermal expansion coefficients between the solder and the C/SiC composite material is effectively reduced; the residual heat stress between the solder and the C/SiC composite material is reduced; and the room-temperature bending strength of the C/SiC composite material and an Ni-based high-temperature alloy joint are improved to 198 MPa.

Description

technical field [0001] The invention relates to the technical field of connection of heterogeneous materials, in particular to a method for connecting a carbon / silicon carbide ceramic matrix composite material and a nickel-based superalloy. Background technique [0002] Carbon / silicon carbide ceramic matrix (C / SiC) composite material overcomes the disadvantages of low temperature resistance and large specificity of metal materials, poor reliability and brittleness of ceramic materials, poor oxidation resistance and low strength of carbon materials, and is not sensitive to cracks and is not easy to crack. Catastrophic damage occurs. It has important application prospects in the aerospace field. [0003] For components with large size and complex structure, they are usually connected to reduce manufacturing difficulty, cost and risk. According to the different functions of each part of the component, it is often necessary to connect C / SiC and metal materials to realize the m...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C04B37/02
Inventor 成来飞范尚武王兴张立同
Owner NORTHWESTERN POLYTECHNICAL UNIV
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