Method for packing alkali metal simple substance
A packaging method, alkali metal technology, applied in metal material coating technology, decorative arts, microstructure devices, etc., can solve problems such as device errors and implementation difficulties, and achieve reduced content of atomic impurities, low cost, and easy integration Effect
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[0073] The concrete realization method of the method for alkali metal simple substance microencapsulation described in this patent is as follows:
[0074] (1) Select an n-type silicon wafer, clean the silicon wafer, and process a silicon-based wax seal forming mold (including a bottom mold, a top mold, and a positive mold), wherein the bottom mold is a silicon-based double-layer stepped structure , the top mold is a double-layer stepped structure based on a silicon base, or a single-layer stepped structure based on a silicon base, and the male mold is a high-low stepped structure with a microneedle array;
[0075] (2) Paraffin wax is selected as the alkali metal packaging material, and its main physical properties are: white particles; melting point: 58°C-62°C; boiling point: 322°C; density: 0.880g / cm3-0.915g / cm3. Melting the paraffin, coating the paraffin on the bottom mold, so that the paraffin fills the step groove;
[0076] (3) On the paraffin layer, the place correspond...
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