Encapsulation method for encapsulating surface glass of flake component

Abstract

The invention belongs to the technical field of flaky component products, and in particular relates to an encapsulation method and encapsulation and spraying equipment thereof for encapsulating surface glass of a flaky component. The encapsulation method comprises the following steps: (1) preparing mounting plates for mounting a flaky component chip; (2) mounting the flaky component chip on a mounting plate; (3) coating protective slurry on one end of the component chip, wherein the protective slurry is used for preventing the glass from being combined with a ceramic body in sintering; (4) spraying glass on four side surfaces of the flaky component chip; (5) drying the coated glass layer; (6) taking off the flaky component chip; (7) sintering the glass; (8) removing the protective slurry; and (9) coating the slurry of an upper end electrode on two ends of the flaky element chip through dipping, and adopting a resistance furnace to frit sliver electrode and semiconductive ceramics tightly so as to obtain a flaky element 10. By using the method, a compact glass protective layer is formed on the surface of the flaky component chip, so that the surface resistance of the flaky component chip is high and the electrofacing overplating doses not exit and the mechanical strength of the flaky component chip is reinforced greatly; and the weldability and welding-proof property of the flaky component chip can be improved effectively, the electric property performance of the flaky component chip is stable, and additionally, the damp-proof performance, and the reliability and stability of high temperature aging and the like of the flaky component chip are increased greatly.

Description

technical field [0001] The invention belongs to the technical field of chip component products. In particular, it relates to a glass spraying and encapsulation method on the surface of chip components and encapsulation and spraying equipment. Background technique [0002] With the development of electronic technology, various electronic components are further multifunctional and intelligent. At the same time, SMT technology increasingly requires the surface mount of electronic components. Chip electronic components have incomparable advantages due to the pinless design: easy installation and high efficiency, no leads - no parasitic inductance. [0003] Various sensitive components (such as: thermistors, varistors, etc.) are also constantly developing and progressing with the chip trend of components. [0004] The current process of chip components is: [0005] 1. Preparation of chip component porcelain powder; 2. Chip component molding; 3. High temperature sintering; ...

AI Technical Summary

Problems solved by technology

[0007] 1. The internal chip surface of the chip component sensitive component is very easy to climb and plate;

[0008] 2. The ceramic body of the sensitive element of the chip component is susceptible to continuous corrosion by the acidic electro-hydraulic, which will seriously reduce the mechanical strength of the chip component itself;

[0009] 3. In order to reduce the climbing plating and corrosion degree of the ceramic body of sensitive components, the electroplating time needs to be shortened, resulting in a reduction in the thickness of the electroplating layer of the terminal electrode, resulting in a decrease in solderability and solder resistance;

[0011] 5. The reliability and stability of chip sensitive components are low

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