Silicon-cup energy-accumulation Al/CuO composite film ignition bridge and ignition bridge array
A composite film and ignition bridge technology, applied in fuzes, offensive equipment, etc., can solve problems such as low energy conversion rate, and achieve the effect of enhancing ignition capability, improving integration, and improving the ability to prevent radio frequency.
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Embodiment 1
[0041] Ignition bridge of single silicon cup concentrated Al / CuO composite thin film
[0042] Fabrication of Si on a 100-sided silicon substrate 3 N 4 mask, which is etched using anisotropic etching technology of silicon such as figure 2 The silicon cup of the regular square pyramid structure shown has a side length of 1mm. The corrosion conditions are: 5% mass concentration of TMAH (tetramethyl ammonium hydroxide) corrosion solution, the corrosion temperature is 85 ℃, when the predetermined depth is reached, use 20% TMAH solution + 1% AP (ammonium perchlorate) , the temperature is 85 ℃, the time is half an hour, and the modification is carried out to reduce the roughness.
[0043] The ignition bridge processing process is as follows: ultrasonically clean the substrate with acetone and deionized water for 30 minutes, dry it in the air, and then put it into a 200°C oven to bake for later use. A positive reversal photoresist (AZ5200) was used to coat the substrate and then ...
Embodiment 2
[0046] Ignition Array Based on Silicon Cup Concentrated Al / CuO Composite Thin Film Ignition Bridge as the Basic Unit
[0047] The silicon cup energy-gathering Al / CuO composite thin film ignition bridge arrays are all fabricated by microfabrication technology, and a micro ignition array can be fabricated based on the single ignition bridge described in Example 1. The structure of the ignition array is as Figure 5 shown.
[0048] Figure 5 The black part is the ignition bridge, which constitutes 6×6 ignition units. The independent ignition of the ignition unit can be realized through the logic addressing circuit between the ignition bus and the unit. The logic addressing circuit material adopts Cu or Au thin film. Cu or Au thin film has lower resistivity and less influence on the ignition bridge, and the width of the circuit is 50μm. Similar to this logic-addressed ignition circuit, it can be used for the ignition of micro-propeller systems, as well as for multi-point igniti...
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