Low temperature cofired ceramic (LTCC)-process-based duplexer with novel structure
A duplexer and process technology, applied in the direction of impedance network, electrical components, multi-terminal pair network, etc., can solve the problems affecting the performance of the duplexer, the miniaturization requirements cannot meet the requirements, and increase the area of the circuit board.
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[0025] figure 2 Shown is this example based on figure 1 Schematic diagram of the duplexer layout. The specific parameters of its instantiation are: the relative dielectric constant of the LTCC material used is 5.9, a total of seven layers of dielectric, each layer of dielectric thickness is 0.096mm, the dielectric loss tangent angle is 0.0015, the metal material is silver, and the thickness of each layer of metal is 0.01 mm, the width of all lines to realize the inductance is 0.15mm, the width of the square pad used is 0.235mm, the diameter of the metallized via hole is 0.185mm, and the via holes are placed in the center of the pad. The lead wire length of the low-pass output port 3 drawn from the low-pass filter 9 is 0.673mm, and the width is 0.235mm. The inductance element 7b of the low-pass filter 9 is realized in a five-layer clockwise spiral manner, and the capacitance element is 0.56mm*0.6 mm double-layer panels, the inductance element 8a is realized by a three-layer ...
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