Thermal radiation heat dissipation light-emitting diode structure and manufacturing method thereof

Abstract

The invention discloses a thermal radiation heat dissipation light-emitting diode structure and a manufacturing method thereof, comprising an LED epitaxial layer, a sapphire substrate, an adhesive heat conduction layer, a thermal radiation heat dissipation film, and a base substrate. The LED epitaxial layer is formed on the sapphire substrate, and the heat radiation The heat dissipation film is formed on the substrate, and the adhesive heat conduction layer is located between the sapphire substrate and the heat radiation heat dissipation film to combine the sapphire substrate including the LED epitaxial layer and the base substrate including the heat radiation heat dissipation film. The heat radiation heat dissipation film contains a metal and non-metal composition, and has a crystalline microstructure, especially with high-efficiency heat radiation heat dissipation characteristics, which can quickly transfer the heat generated by the LED epitaxy layer to the base in the form of heat radiation Therefore, it can greatly reduce the operating temperature of the LED epitaxial layer, maintain stable light-emitting operation and extend the service life.

Description

technical field [0001] The invention relates to a heat radiation heat dissipation light-emitting diode (LED) structure and a manufacturing method thereof, in particular to a light emitting diode structure and a manufacturing method having a heat radiation heat dissipation film to enhance heat dissipation efficiency through heat radiation. Background technique [0002] In recent years, with the gradual prevalence of environmental protection, energy saving and carbon reduction, LED has become one of the most important options to replace general light sources due to its high luminous efficiency. [0003] refer to figure 1 , is a schematic diagram of the light emitting diode structure in the prior art. Such as figure 1 As shown, the LED structure 1 in the prior art generally includes an LED chip 10 , a sapphire substrate 20 , silver glue 30 , a bracket 40 , a base substrate 50 , a plurality of connecting wires 60 , encapsulation glue 70 and a heat dissipation aluminum substrat...

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Problems solved by technology

[0004] Since the heat conduction efficiency depends on the thermal conductivity of the material and the conduction area, in the prior art, in order to increase the heat conduction area, the size of the LED structure 1 must be increased, resulting in limited use

In addition, the surface area of ​​the heat dissipation aluminum substrate 80 also determines the overall heat dissipation efficiency, so the heat dissipation aluminum substrate 80 generally has a large geometric appearance, which increases the weight of the overall LED structure 1, and makes the LED structure 1 very heavy.

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