Method for generating nano-copper particles on the surface of copper alloy film

Abstract

The method for generating nano-copper particles on the surface of a copper alloy film adopts the following steps: 1. First, deposit a Cu-Zr alloy film on a polyimide PI substrate to form a Cu-Zr / PI film-based system; 2. Then prepare the Cu-Zr alloy film The film-based system, under the condition that the vacuum degree is better than 1*10-3, the temperature is 100-400 ° C, annealed for 5-10 minutes, so that pure Cu particles with nanometer or submicron scale are formed on the surface of the polyimide matrix film. ; or by oxidizing the prepared copper particles to achieve copper oxide particles. The beneficial effects of the present invention: the method is simple, the cost is low, and it is easy to prepare large-area, high-density, and scale-controllable nano-scale pure Cu particles or oxide particles on the surface of the film; the prepared pure Cu particles or oxide particles can be used to prepare Flexible electronic devices and photoelectric display devices; the preparation method of the present invention can also provide reference for the preparation of other metal particles with similar properties.

Description

[0001] technical field [0002] The invention relates to the preparation technology of nanometer materials, in particular to a method for preparing nanometer pure copper particles on the Cu-Zr surface of polyimide substrate copper-zirconium alloy film. Background technique [0003] With the development of submicron science and technology, the excellent properties and broad application prospects of micron and nanoparticle are gradually recognized by researchers and have aroused great interest of materials scientists, physicists and chemists all over the world. When the size reaches the nanometer level, the particles will show obvious quantum size effect, small size effect, surface effect and macroscopic quantum tunneling effect, and have broad application prospects in the fields of catalysis, light filtering, light absorption, medicine, magnetic media and new materials. . [0004] Due to good comprehensive performance and cost advantages, pure copper Cu and its alloy materia...

AI Technical Summary

Problems solved by technology

Dhas et al. prepared Cu particles with a diameter of 200-250 nm by hydrothermal reduction method. This method involves many preparation steps and process parameters, and the experiment period is long.

In addition, pure Cu particles can also be prepared by traditional sputtering methods, but the size of the prepared pure Cu particles is limited. Once the particle size exceeds a dozen nanometers, the particles will connect to each other to form a thin film.

Based on the current research status, it can be seen that although submicron and nanoscale copper particles can be prepared by various methods in the laboratory, the prepared copper particles are basically free monodisperse particles or agglomerated particles. Together, it is difficult to fix these particles on the substrate or film surface

Although pure copper particles can be grown on the surface of the substrate or film by the template method, this method is complex in technology, and it is easy to pollute the Cu particles in the process of removing the template, so it is not suitable for the needs of industrial development.

In summary, it can be seen that the existing technical methods are difficult to grow Cu particles that are well combined with the film on the surface of the film. In view of this problem, the purpose of the present invention is to propose a self-formation scale on the film surface that is controllable and integrated with the film. Method for combining well-formed monodisperse micro- and nanoscale Cu particles

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