A kind of defoamer for printed circuit board cleaning

A technology for printed circuit boards and defoamers, which is applied in the direction of foam dispersion/prevention, and can solve problems such as transparency effects, solubility aiding foam, and reduction of copolymer solubility

Active Publication Date: 2011-12-28
JIANGSU SIXIN SCI-TECH APPL RES INST CO LTD
View PDF8 Cites 16 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

If the ratio of polysiloxane segment to polyether segment is fixed, increasing the ratio of polyoxypropylene in the polyether chain will reduce the solubility of the copolymer in water and reduce the cloud point. Generally speaking, it can improve its solubility. Foam performance, but th

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • A kind of defoamer for printed circuit board cleaning
  • A kind of defoamer for printed circuit board cleaning
  • A kind of defoamer for printed circuit board cleaning

Examples

Experimental program
Comparison scheme
Effect test

Example Embodiment

[0034] Example 1

[0035] At room temperature, the silicon polyether A1 was mixed with diethylene glycol butyl ether and deionized water in a ratio of 5:8:87.

Example Embodiment

[0036] Example 2

[0037] At room temperature, the silicon polyether A2 was mixed with ethylene glycol hexyl ether, deionized water, and sodium dodecylbenzenesulfonate in a ratio of 8:13:78:1.

Example Embodiment

[0038] Example 3

[0039] At room temperature, the silicon polyether A3 was mixed with ethylene glycol butyl ether, deionized water, and sodium tetradecyl diphenyl ether disulfonate in a ratio of 6:10:81:3.

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

PUM

PropertyMeasurementUnit
Dynamic viscosityaaaaaaaaaa
Login to view more

Abstract

The invention provides a defoamer for cleaning printed circuit boards, which is formed by well mixing 5-15% of defoaming active matter, 5-15% of organic solvents, 0-5% of anionic surfactants, and 65-90% of diluents. The defoaming active matter is silicon polyether; the organic solvent is an alcohol ether solvent; the anionic surfactant is an alkyl aromatic surfactant or an alkyl polyoxyethylene ether surfactant. The defoamer of the invention exhibits excellent defoaming and foam-inhibiting performance and compatibility in the cleaning of printed circuit boards, and also has the advantages of high security and good stability.

Description

technical field [0001] The invention relates to a defoamer for cleaning printed circuit boards. Since the defoamer belongs to fine chemicals, the present invention belongs to the technical field of fine chemical preparations. technical background [0002] Bubbles are a common phenomenon in life and work. However, in industrial production, sometimes foam can cause great harm, such as reducing the working efficiency of machines, delaying working hours, and affecting product quality. There are mainly physical methods and chemical methods to eliminate harmful foam, and defoamer defoaming is one of the chemical methods. With the substantial increase in the production scale and production efficiency of industrial enterprises, defoamers and defoamers have been more widely used. At present, defoamers have been widely used in papermaking, textile printing and dyeing, oil exploration and refining, coatings, emulsion polymerization, sewage treatment, metal cleaning and other industr...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

Application Information

Patent Timeline
no application Login to view more
IPC IPC(8): B01D19/04
Inventor 黄伟吴飞曹添何庆海
Owner JIANGSU SIXIN SCI-TECH APPL RES INST CO LTD
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Try Eureka
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap