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A kind of thermosetting photosensitive resin composition

A technology of photosensitive resin and composition, which is applied in epoxy resin coating, optics, photomechanical equipment, etc. It can solve the problems of poor drying performance and achieve high temperature and high humidity resistance

Inactive Publication Date: 2011-12-28
CHANGSHA HUIHUA ADHESIVE & TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0008] The composition disclosed in Japanese Patent Laid-Open Publication No. 5-202332 contains a photosensitive resin, which has more than two acrylate groups and more than one carboxylic acid group in one molecule. It has high resolution and excellent electrical properties, but its The molecular weight of the photosensitive resin is less than 1000, and the drying performance is poor

Method used

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  • A kind of thermosetting photosensitive resin composition
  • A kind of thermosetting photosensitive resin composition

Examples

Experimental program
Comparison scheme
Effect test

Synthetic example 1

[0034]Put 74g (0.2mol) of curcumin, 270g of methoxyethyl diacetate, 60.8g (0.4mol) of tetrahydrophthalic anhydride and 0.2g of hydroquinone into the reactor, raise the temperature to 110°C, and react for 3 hours to obtain Modified Curcumin (C-1).

Synthetic example 2

[0036] 39.2 g (0.4 mol) of ethyl maleic anhydride was substituted for the tetrahydrophthalic anhydride in Synthesis Example 1 of modified curcumin to obtain modified curcumin (C-2).

Synthetic example 3

[0038] 21.8g (0.1mol) of pyromellitic dianhydride (pyromellitic dianhydride) combined with 30.4g (0.2mol) of tetrahydrophthalic anhydride (tetrahydrophthalic anhydride) was used to replace the tetrahydrophthalic anhydride of Curcumin Modification Synthesis Example 1 to obtain turmeric Primer Modified (C-3).

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PUM

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Abstract

The invention provides a thermocuring photosensitive resin composition, which can be used for a photoresist and a photosensitive insulating layer of paints, printing inks and printed circuit boards. The thermocuring photosensitive resin composition mainly comprises the following components by mass percentage: (a) 5-60% of photosensitive resin; (b) 5-60% of responsive diluent; (c) 0.01-20% of curcumin modified substance which has at least two nonsaturated double bonds and at least two carboxylic groups; (d) 0.1-15% of photoinitiator; and (e) 0.5-40% of thermosetting resin.

Description

[0001] technical field [0002] The invention relates to a thermosetting photosensitive resin composition, which can be applied to coatings, inks, photoresists for printed circuit boards, photosensitive insulating layers, etc., and is especially suitable for green paints for protective coating films on the surface of printed circuit boards. Background technique [0003] The printed circuit board is the main carrier and support for the installation and interconnection of electronic components, and is an indispensable and important component of electronic products. [0004] In recent years, due to the development of electronic products towards light and thin, portable, composite functions and high density, and with the demand for high I / O numbers, miniaturization and miniaturization of electronic equipment, the technology of printed circuit boards has also It must be continuously improved accordingly, and the physical and chemical properties of related materials are also requi...

Claims

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Application Information

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IPC IPC(8): G03F7/004G03F7/027C09D11/10C09D163/10H05K3/28C09D11/101C09D11/107
Inventor 于广水梁轶聪胡海波
Owner CHANGSHA HUIHUA ADHESIVE & TECH CO LTD