Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Surface activation method for nonmetal material

A non-metallic material and surface activation technology, which is applied in the field of surface activation of non-metallic materials, can solve the problems of large unit consumption of activation solution and waste of precious metal palladium, etc.

Inactive Publication Date: 2012-01-18
SHENZHEN FARCIEN APPLIED MATERIALS
View PDF2 Cites 8 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, in the process of using the activating solution to activate the surface of non-metallic materials, the unit consumption of the activating solution is relatively large, especially the consumption of the carry-out loss of the activating solution is much greater than its adsorption consumption, so the waste of precious metal palladium is relatively large. serious

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Surface activation method for nonmetal material
  • Surface activation method for nonmetal material

Examples

Experimental program
Comparison scheme
Effect test

preparation example Construction

[0029] In the preparation process of printed circuit boards, the pre-dip solution is a sacrificial solution. Its main function is to reduce pollutants or copper ions from being brought into the activation tank. In the activation solution, ensure the necessary base content (specific gravity) and acidity in the activation solution, maintain the stability of the activation solution, and avoid the hydrolysis of the tin-palladium colloid in the activation solution. The pre-dipping solution used in the present invention can be prepared according to methods well known to those skilled in the art. Preferably, the pre-dipping solution includes sodium chloride, inorganic acid, stabilizer and antioxidant. In the present invention, tin-palladium colloid is firstly added to the pre-dipping solution, so that the obtained mixed solution has a certain palladium concentration while functioning as the original pre-dipping solution, thereby having a certain activation effect on the non-metallic s...

Embodiment 1

[0041] The tin-palladium colloidal activator used in this embodiment is the tin-palladium colloidal activator of model CA-230 produced by Shenzhen Huaxun Applied Materials Co., Ltd.

[0042] Be that the stock solution of palladium concentration is 1650ppm with 2% matching tank, the palladium concentration of activation tank matching tank is 33ppm, collocation 200g / L composition is sodium chloride presoaker A and 70ml / L contain sulfuric acid, stabilizing agent, anti Pre-dipping agent B of the oxidizing agent builds a bath, and transfers 20% of the activation solution from the activation tank to the pre-dipping tank to establish the initial palladium concentration to obtain a mixed solution;

[0043] According to the experimental parameters shown in Table 1, adjust the production line crane program time, the immersion time and dripping time of each operation tank, etc.;

[0044] The process parameter that table 1 embodiment 1 adopts

[0045]

[0046] The test was carried out...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

PropertyMeasurementUnit
thicknessaaaaaaaaaa
pore sizeaaaaaaaaaa
Login to View More

Abstract

The present invention discloses a surface activation method for a nonmetal material. The method comprises the following steps: adding tin palladium colloid to a pre-immersion solution to obtain a mixed solution; immersing a nonmetal substrate in the mixed solution; immersing the processed nonmetal substrate in a first activation solution, and then immersing the nonmetal substrate in the mixed solution. According to the present invention, the nonmetal substrate processed by the first activation solution is immersed in the mixed solution, such that the first activation solution absorbed on the surface of the nonmetal substrate, in the inner holes of the nonmetal substrate, and in the skeleton gaps of the nonmetal substrate are taken out and can be completely released in the mixed solution so as to reduce the waste of the noble metal palladium; the nonmetal substrate is respectively subjected to the low concentration activation treatment, the high concentration activation treatment and the low concentration activation treatment so as to provide the three activation functions at different concentrations for the nonmetal substrate, to enable adsorption of the activator, and the completeness and the compactness of the plating coat, to reduce specific consumption of the noble metal palladium, and to ensure the activation effect of the nonmetal material.

Description

technical field [0001] The invention relates to the technical field of surface activation, in particular to a method for surface activation of non-metallic materials. Background technique [0002] At present, with the rapid development of global electronic information technology and communication technology, the printed circuit (PCB) industry has become the largest pillar of the electronic component manufacturing industry worldwide. The preparation of printed circuit boards mainly includes the following steps: after drilling the multi-layer non-metallic board, remove the smear (Smear) generated by the drilling through the smear removal process, and then clean the whole hole, micro-etch, pre-dip, activation, speed Metallization and electroless copper plating are used to metallize the non-metallic material in the hole wall of the printed circuit board, so as to realize the electrical conduction between the layers of the printed circuit board. [0003] Activation treatment is ...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): C23C18/18C23C18/30
Inventor 邱文裕
Owner SHENZHEN FARCIEN APPLIED MATERIALS
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com