The invention relates to a semiconductor lead frame manufacturing technology which comprises the steps of stamping, surface treatment and cut-forming. The technology is characterized in that the surface treatment process specifically comprises the steps of electrolytic degreasing, washing, acid activation, washing, nickel plating, washing, alkaline copper plating, washing, acid copper plating, washing, silver preplating, washing, silver plating, silver removing, washing, protective solution plating, washing and drying. Plated layers of a semiconductor lead frame manufactured with the method are high in adhesive force and do not fall off easily. Meanwhile, the semiconductor lead frame is free of deformation and oversize, high in quality, and long in service life.