Quad flat non-leaded package structure and method of micro electro mechanical system device

Abstract

The invention discloses a quad flat non-leaded (QFN) package structure and a quad flat non-leaded package method of a micro electro mechanical system (MEMS) device. The structure comprises a substrate, an application specific integrated circuit (ASIC) chip, an MEMS chip and a plastic material, wherein the ASIC chip is adhered to the substrate; the MEMS chip is adhered to the ASIC chip; the substrate, the ASIC chip and the MEMS chip are packaged and a lead on the substrate is exposed by the plastic material; a micro bonding pad on the ASIC chip is connected with a lead on the substrate through a lead wire; a micro bonding pad on the MEMS chip is connected with the micro bonding pad on the ASIC chip through a lead wire; and on the ASIC chip, the micro bonding pad which is connected with the micro bonding pad on the MEMS chip is different from the micro bonding pad which is connected with the lead on the substrate. In the invention, the ASIC chip and the MEMS chip are packaged into an MEMS device with the ASIC chip by using a stacking mode; the method has the advantages of small product size, simple manufacturing process, superior performance and high heat dissipation performance; the conventional QFN production and manufacturing process can be utilized; and another choice is provided for packaging of the MEMS device.

Description

Technical field [0001] The present invention relates to the technical field of micro-electro-mechanical systems, in particular to a square flat no-lead packaging structure and method for micro-electro-mechanical system devices. Background technique [0002] MEMS (Micro Electro Mechanical systems) technology is a 21st century cutting-edge technology based on micro / nanotechnology. It refers to the design, processing, manufacturing, measurement and control of micro / nano materials technology. It can integrate mechanical components, optical systems, drive components, and electrical control systems into a micro system that is an integral unit. MEMS can not only collect, process and send information or instructions, but also take actions autonomously or according to external instructions according to the acquired information. It adopts a manufacturing process that combines microelectronics technology and micromachining technology to manufacture a variety of excellent performance, low ...

AI Technical Summary

Problems solved by technology

[0005] Usually, MEMS devices need to use ASIC (Application Specific Integrated Circuits, Application Specific Integrated Circuits) chips to achieve specific functions. However, due to the large difference between the manufacturing process of MEMS devices and the manufacturing process of ASICs, it is impossible to use CMOS (Complementary Metal Oxide Semiconductor, complementary metal Oxide Semiconductor) Wafer Manufacturing Process Completed Simultaneously

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