Quad flat non-leaded package structure and method of micro electro mechanical system device
A micro-electro-mechanical system and leadless packaging technology, applied in the field of micro-electro-mechanical systems, can solve problems such as simultaneous manufacturing and completion, and achieve the effects of small product size, superior performance, and good heat dissipation
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[0061] In order to make the objectives, technical solutions, and advantages of the embodiments of the present invention clearer, the following describes the embodiments of the present invention in further detail with reference to the accompanying drawings. Here, the exemplary embodiments of the present invention and the description thereof are used to explain the present invention, but not as a limitation to the present invention.
[0062] Picture 11 with Picture 12 It is a schematic diagram of a specific embodiment of the OFN structure of the MEMS device in the embodiment of the present invention. Figure 13 with Picture 14 It is a schematic diagram of another specific embodiment of the OFN structure of the MEMS device in the embodiment of the present invention. reference Figure 11 to Figure 14 The OFN structure of the MEMS device in the embodiment of the present invention may include:
[0063] Substrate
[0064] ASIC chip 20 pasted on the substrate;
[0065] MEMS chip 10 paste...
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