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Water base cutting fluid for cutting silicon wafers

A silicon wafer cutting, water-based technology, applied in the direction of lubricating composition, etc., can solve the problems of low yield and poor wear resistance of cutting silicon wafers, and achieve the effects of easy cleaning, improved lubricating effect, and improved dispersibility

Inactive Publication Date: 2012-02-29
ZHENJIANG GANGNAN ELECTRIC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Although the silicon chip cutting fluid in the prior art has good lubricating and thermal conductivity properties, it has the problems of poor wear resistance and low yield of cutting silicon chips

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0009] The present invention is a water-based cutting fluid for silicon wafer cutting, which is composed of 60% ethylene glycol, 4% oleic triethanolamine, non-ionic surfactant H5%, extreme pressure antiwear agent 1%, and water 30%. By calculation, the above raw materials are stirred for 2 minutes at a temperature of 120 degrees at a speed of 120r / min.

[0010] Performance index: this cutting fluid and S i The C abrasive is mixed in a ratio of 1:1 parts by weight to cut the silicon wafer. The number of cut pieces is 2000, and the cutting yield is 95.1%. The wear resistance is good, the cooling performance is good, and the silicon wafer is easy to clean.

Embodiment 2

[0012] The invention is a water-based cutting fluid for silicon wafer cutting, which is composed of ethylene glycol 65%, oleic acid triethanolamine 3%, nonionic surfactant H3%, extreme pressure antiwear agent 1%, and water 28%. Calculation. The above raw materials are stirred for 2 minutes at a temperature of 120 degrees at a speed of 120 r / min.

[0013] Performance index: this cutting fluid and S i The C abrasive is mixed at a ratio of 1:1 parts by weight to cut the silicon wafer. The number of cut pieces is 2000, and the cutting yield is 98.7%. The wear resistance is good, the cooling performance is good, and the silicon wafer is easy to clean.

Embodiment 3

[0015] The present invention is a water-based cutting fluid for silicon wafer cutting, which is composed of 70% ethylene glycol, 2% oleic triethanolamine, non-ionic surfactant H3%, extreme pressure antiwear agent 1%, and water 24%. Calculation. The above raw materials are stirred for 2 minutes at a temperature of 120 degrees at a speed of 120 r / min.

[0016] Performance index: this cutting fluid and S i The C abrasive is mixed in a ratio of 1:1 parts by weight, and the silicon wafer is cut. The number of cut pieces is 2000, and the cutting yield is 97.7%. The wear resistance is good, the cooling performance is good, and the silicon wafer is easy to clean.

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PUM

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Abstract

The invention provides a water base cutting fluid for cutting silicon wafers, which consists of glycol, triethanolamine oleate, non-ionic surface active agents, extreme pressure antiwear agents and water. The water base cutting fluid has the advantages that the surface tension of the cutting fluid is greatly reduced, the flowability and the permeability of the cutting fluid are greatly improved, the wettability of the cutting fluid on grinding materials is greatly improved, the dispersibility of the grinding materials is improved, the damage to the silicon wafers brought by aggregation and agglomeration of the grinding materials is avoided, the increase of the silicon wafer cutting yield is facilitated, and the silicon wafer cutting yield can reach 98 percent; and protective films can be formed on the surfaces of the silicon wafers, so the silicon wafers are easier to clean, and the lubricating effect, the abrasion performance and the cooling performance of the cutting fluid are improved.

Description

Technical field [0001] The invention relates to a cutting fluid, in particular to a cutting fluid for silicon wafer cutting. Background technique [0002] With the development of society and the maturity of the solar photovoltaic industry, more and more silicon wafers are used. Since silicon wafer is a hard material, its cutting process occupies a very important position in the processing technology. The silicon wafer is supplied with abrasive mortar through the cutting line, and the cutting of the silicon wafer is realized through the principle of abrasive wear between the abrasive, the cutting line and the silicon crystal. This method can realize the cutting of multiple silicon wafers with high cutting efficiency. There is more friction between the abrasive and the cutting wire, which requires higher cooling and lubrication of the cutting wire. Although the silicon chip cutting fluid in the prior art has good lubrication and thermal conductivity, it has the problems of poor w...

Claims

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Application Information

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IPC IPC(8): C10M173/02
Inventor 聂金根
Owner ZHENJIANG GANGNAN ELECTRIC
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