Lead-free LED (Light-Emitting Diode) module and manufacturing process thereof

Abstract

The invention relates to a lead-free LED (Light-Emitting Diode) module and a manufacturing process thereof. The LED module comprises a radiator, a PCB (Printed Circuit Board), an LED chip, an encapsulating colloid, sealing silica gel and a lens module, wherein the LED chip is welded on the PCB; the anode and cathode of the LED chip are welded on corresponding electrode pads respectively; the PCB is jointed with the radiator; and the lens module is arranged above the LED chip, and is filled with the encapsulating colloid. The LED chip is directly welded on the circuit board, so that the conventional LED encapsulating process is eliminated, a bracket comprising a heat sink is eliminated, heat of the LED chip is directly diffused to the high-heat-conductivity circuit board and the radiator, and the radiating effect is enhanced. Only the sealing colloid is arranged between the lens module and the LED chip, so that light rays pass through a small quantity of media, and the transmittance is high; and the filling colloid is matched with the refractive index of the lens module, so that the reflection loss is small, and the light emitting rate of the LED module is increased.

Description

technical field [0001] The invention relates to the field of semiconductor application and packaging, more specifically, to a leadless LED module and its manufacturing process. Background technique [0002] With the development of LED chip technology and packaging technology, more and more LED products are used in the field of lighting, especially high-power white LEDs. Due to the characteristics of high light efficiency, long life, energy saving and environmental protection, suitable dimming control, and no mercury and other pollutants, LEDs have become a new generation of lighting sources after traditional light sources such as incandescent lamps and fluorescent lamps. [0003] LED is an electroluminescent semiconductor device, in which about 30% of the electrical energy is converted into light, and the remaining electrical energy is converted into heat, and the temperature rise of LED caused by heat accumulation is the main cause of LED light decay. Therefore, LED chip h...

AI Technical Summary

Problems solved by technology

The above-mentioned LED module has the following defects: because the heat dissipation of the LED chip needs to pass through many interlayers in the heat conduction channel, and the medium between the LED heat sink and the PCB board 102, and the medium between the PCB board 102 and the radiator 101 is air or silicone grease. Vias have low thermal conductivity, so thermal performance is poor

[0007] For general LED application lamps, after the light is emitted from the chip, it generally passes through: phosphor, packaging lens, air, light distribution lens, and then to the light transmission cover. The light passes through many media, and reflection loss occurs at each interface, so the total low optical transmittance

Therefore, there are disadvantages such as poor heat dissipation performance, low optical transmittance, complicated production process, and high cost.

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