Preparation method of aluminum alloy and rare earth nickel base electromagnetic shielding layer
An electromagnetic shielding layer, aluminum alloy technology, applied in metal material coating process, coating, liquid chemical plating and other directions, can solve the problems of inability to meet the electromagnetic shielding requirements of products, high cost, large surface resistance, etc. Shielding and anti-corrosion, low cost, excellent shielding performance
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
Method used
Examples
Embodiment 1
[0012] Put the electronic components made of aluminum alloy into the electroless plating solution for 10-15 minutes and then take them out to air dry. The surface of the aluminum alloy substrate is modified, and a layer of rare earth with a thickness of 0.01mm and a plating hardness of 600Hv is obtained on the surface of the aluminum alloy substrate. Nickel based electromagnetic shielding layer. The electroless plating solution contains 0.10~0.13mol / L NIC1 2 ·6H 2 O, 0.02~0.03mol / LFeSO 4 ·7H 2 O, 0.03~0.04mol / L dimethylaminoborane, 0.07~0.09mol / L Na 2 C 4 h 4 o 6 2H 2 O, 0.07~0.075 mol / L glycine, 0.035~0.05mol / L H 3 BO 3 , 1×10 -3 mol / L stabilizer, micro-nano molybdenum disulfide particles 3g / L, use KOH to adjust the pH value of the electroless plating solution to 7~8, and then put the aluminum alloy substrate into it. The reducing agent is formulated from hypophosphite, borohydride, and dimethylaminoborane (DMAB), and the ratio is 1:3:2. Stabilizer is Ce salt nam...
Embodiment 2
[0014] Put the product made of aluminum alloy into the chemical plating solution for 10 to 15 minutes and then take it out, and obtain a rare earth nickel-based electromagnetic shielding layer with a thickness of 0.05mm and a plating hardness of 650Hv on the surface of the aluminum alloy substrate; the chemical plating solution Contains 0.10~0.13mol / L NIC1 2 ·6H 2 O, 0.02~0.03mol / LFeSO 4 ·7H 2 O, 0.03~0.04mol / L dimethylaminoborane, 0.07~0.09mol / L Na 2 C 4 h 4 o 6 2H 2 O, 0.07~0.075 mol / L glycine, 0.035~0.05mol / L H 3 BO 3 , 2×10 -3 mol / L stabilizer LaC1 3 , Molybdenum disulfide particles of micro-nano scale 4g / L, adjust the pH value of the electroless plating solution to 7~8 with KOH or / and NaOH, and then put the aluminum alloy substrate into it. The reducing agent is formulated from hypophosphite, borohydride, and dimethylaminoborane (DMAB), the ratio is: 1:3:2, and the stabilizer is La salt, namely LaC1 3 .
Embodiment 3
[0016] Put the product made of cast aluminum into the chemical plating solution for 10~15 minutes and then take it out. The surface of the aluminum alloy substrate is modified to obtain a layer of rare earth nickel with a thickness of 0.1mm and a hardness of 550Hv on the surface of the aluminum alloy substrate. base electromagnetic shielding layer; the chemical plating solution contains 0.10~0.13mol / L NIC1 2 ·6H 2 O, 0.02~0.03mol / LFeSO 4 ·7H 2 O, 0.03~0.04mol / L dimethylaminoborane, 0.07~0.09mol / L Na 2 C 4 h 4 o 6 2H 2 O, 0.07~0.075 mol / L glycine, 0.035~0.05mol / L H 3 BO 3 , 1.5×10 -3 mol / L stabilizer, micro-nano molybdenum disulfide particles 5g / L, use KOH or / and NaOH to adjust the pH value of the electroless plating solution to 7~8, and then put the aluminum alloy substrate into it. The original agent is prepared from hypophosphite, borohydride, dimethylaminoborane (DMAB), the ratio is: 1:3:2, and the stabilizer is Ce C1 2 and LaC1 3 mixture.
PUM
Property | Measurement | Unit |
---|---|---|
Thickness | aaaaa | aaaaa |
Thickness | aaaaa | aaaaa |
Thickness | aaaaa | aaaaa |
Abstract
Description
Claims
Application Information

- R&D Engineer
- R&D Manager
- IP Professional
- Industry Leading Data Capabilities
- Powerful AI technology
- Patent DNA Extraction
Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.
© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com