Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Black curable resin composition

A technology of curable resin and composition, which can be used in secondary processing of printed circuits, printed circuit parts, and photosensitive materials for opto-mechanical equipment, etc. Achieve improved resolution and dimensional accuracy, prevent insufficient photocuring, and improve resolution

Active Publication Date: 2012-03-21
TAMURA KK
View PDF7 Cites 8 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, in Patent Document 2, since a colorant other than a black colorant is used to make it black, the process of adjusting it to black is difficult and cumbersome, and in order to increase the blackness, the content of the colorant is increased, and there is still a problem of poor resolution. full question

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Black curable resin composition
  • Black curable resin composition

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1~13、 comparative example 1~5

[0069] The ingredients shown in Table 1 below were blended in the mixing ratio shown in Table 1 below, and after premixing with a mixer, they were mixed and dispersed using a three-roll mill at room temperature to prepare Examples 1-13 and Comparative Example 1. ~5 Black curable resin composition used. Then, the prepared black curable resin composition was coated on the substrate by the following test piece preparation process to prepare a test piece. The compounding amount of each component shown in the following Table 1 shows a mass part unless otherwise indicated.

[0070] 【Table 1】

[0071]

[0072] In addition, the details of each component in Table 1 are as follows.

[0073] (A) carboxyl-containing photosensitive resin

[0074] ·Ripoxy SP-4621: Showa Polymer Co., Ltd., polyacid-modified cresol novolac type acrylic epoxy resin

[0075] (B) Photopolymerization initiator

[0076] ·IRGACURE 907: 2-Methyl-1-[4-(methylthio)phenyl]-2-morpholinopropane-1-one manufactured by Ciba Fine Ch...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

PropertyMeasurementUnit
wavelengthaaaaaaaaaa
acid valueaaaaaaaaaa
thicknessaaaaaaaaaa
Login to View More

Abstract

The invention aims to provide a black curable resin composition that is excellent in resolution characteristics and easy for adjustment to a black color, and allows color tone variation after heat treatment to be prevented. The black curable resin composition includes: a photosensitive carboxylic resin (A); a photopolymerization initiator (B); a diluent (C); an epoxy compound (D); and a black colorant (E). The black curable resin composition is characterized in that the black colorant (E) includes a carbon black-based black colorant (E-1) and a perylene-based black colorant (E-2), and contains 53 mass% or more of the perylene-based black colorant (E-2).

Description

Technical field [0001] The present invention relates to a black curable resin composition having excellent resolution. For example, it relates to the following black curable resin composition, which when used as a solder resist for a printed circuit board, can correspond to the fine pitch of electrodes. Pitch) and miniaturization, and excellent black color tone, even after heat treatment can prevent color tone change. Background technique [0002] The printed circuit board is used to form a conductor circuit pattern on the substrate, and electronic components are mounted on the patterned land by soldering, and the circuit part that does not include the land is covered with a solder resist film as a permanent protective film. As a result, when soldering electronic components on a printed circuit board, the solder is prevented from adhering to unnecessary parts, and at the same time, the circuit conductor is prevented from being directly exposed to the air and corroded by oxidation...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): G03F7/004H05K1/02H05K3/28
Inventor 熊谷一彦谷口裕亮西山弘恭
Owner TAMURA KK
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products