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Multipath radial waveguide power combining amplifier

A technology of power combiner and radial waveguide, which is applied in the field of microwave and millimeter wave communication and radar, can solve the problems of limited combined power, narrow working bandwidth and low combining efficiency, and achieve large power capacity, wide working bandwidth and high combining efficiency Effect

Inactive Publication Date: 2012-04-11
HANGZHOU DIANZI UNIV
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AI Technical Summary

Problems solved by technology

The traditional planar circuit power combination technology is no longer applicable due to some inherent defects such as limited combined power, low combined efficiency, narrow working bandwidth, and poor heat dissipation.

Method used

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  • Multipath radial waveguide power combining amplifier

Examples

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Embodiment Construction

[0017] Such as figure 1 As shown, a multi-path waveguide power combiner amplifier includes a radial waveguide power divider 1, a radial waveguide power combiner 2 and an amplifier chip array 3.

[0018] Such as figure 2 As shown, the structure of the radial waveguide power splitter and the radial waveguide power combiner are exactly the same, specifically: including a side metal wall 5, an upper metal wall 4, and a lower metal wall 6; the side metal wall 5 is a cylindrical metal tube , The upper metal wall 4 and the lower metal wall 6 are round metal sheets with the same diameter as the outer diameter of the side metal wall 5. The upper metal wall 4 and the lower metal wall 6 are respectively fixed on the two ends of the side metal wall 5. The upper metal wall 4 The inner surface of the lower metal wall 6 and the inner surface of the side metal wall 5 enclose a cylindrical radial waveguide cavity. The center of the outer surface of the upper metal wall 4 is fixedly provided wit...

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Abstract

The invention relates to a multipath radial waveguide power combining amplifier. A radial waveguide power divider and a radial waveguide power combiner are fixed at two ends of an amplifier chip array, and have the same structure, and a radial waveguide cavity is enclosed by an upper metal wall, a lower metal wall and a lateral metal wall; a subminiature version A (SMA) connector is arranged in the center of the outer side of the upper metal wall, and a main coaxial probe is arranged in the center of the inner side of the upper metal wall; a plurality of branch coaxial probes are arranged on the lower metal wall; the main coaxial probe and the branch coaxial probes are cylindrical metal rods of which the radii are changed in a gradient way; each lateral face of a polygonal metal column of the amplifier chip array is fixed with a solid-state power amplifier chip; and the branch coaxial probes of the radial waveguide power divider and the radial waveguide power combiner are connected with microstrip lines at two ends of the solid-state power amplifier chip. The multipath radial waveguide power combining amplifier has the advantages of good amplitude phase consistency, high combined efficiency, high power capacity, wide working bandwidth, high heat sink performance and the like.

Description

Technical field [0001] The invention belongs to the technical field of microwave and millimeter wave communication and radar, and relates to a multipath waveguide power synthesis amplifier, which is suitable for microwave and millimeter wave power synthesis and amplification. Background technique [0002] With the increasing demand for modern radio communications (such as GPS, WLAN, SAR, LMDS, Bluetooth, and PCS), the radio frequency spectrum has become overcrowded. Therefore, higher spectrum resources must be developed. However, as the operating frequency continues to rise, especially after entering the microwave and millimeter wave frequency bands, the power output capability of a single solid-state device is greatly reduced, which is far from meeting the requirements of the communication system. Therefore, if you still want to use solid-state communication technology in the field of microwave and millimeter waves, you must use power synthesis technology to improve the power o...

Claims

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Application Information

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IPC IPC(8): H01P5/12H03F3/60H03F3/20
Inventor 骆新江
Owner HANGZHOU DIANZI UNIV
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