Transfer plate with metal vertical interconnection structure and manufacture method thereof

Abstract

The invention discloses a transfer plate with a metal vertical interconnection structure and a manufacture method thereof. The transfer plate comprises a base plate, a passivation layer, a metal salient point structure and a metal interconnection wire, wherein the passivation layer is formed at the lower surface of the base plate, and the metal salient point structure is formed at the lower surface of the passivation layer. The metal salient point structure comprises a welding disc and a metal salient point, wherein the welding disc is buried inside the passivation layer, the metal salient point is formed on the lower surface of the welding disc, one part of the metal salient point is buried inside the passivation layer, and the other part of the metal salient point is exposed out of the lower surface of the passivation layer. The metal interconnection wire extends from the upper surface of the base plate to the lower surface of the base plate, penetrates through the whole base plate and passes through the passivation layer and the welding disc until reaching the inside of the metal salient point, so the metal salient point is electrically connected with devices arranged above the base plate through the metal interconnection wire. The transfer plate and the manufacture method have the advantages that the process is simple, the cost is low, and a high hole making qualified rate is realized, so the problems of high hole filling cost, complicated process and the like of the metal vertical interconnection structure are solved.

Description

technical field [0001] The invention belongs to the technical field of three-dimensional stacking in chip packaging technology, and in particular relates to an adapter plate with a metal vertical interconnection structure and a manufacturing method thereof. Background technique [0002] In recent years, advanced packaging technology has appeared in the IC manufacturing industry, especially 3D packaging first breaks through the traditional concept of planar packaging, and the assembly efficiency is as high as 200%. In 3D packaging technology, multiple chips can be stacked in a single package to double the storage capacity, which is called stacked 3D packaging in the industry. Second, by directly interconnecting the chips, the length of interconnect lines is significantly shortened, allowing signals to travel faster and with less interference. Thirdly, by stacking multiple chips with different functions together, a single package can realize more functions, thus forming a new...

AI Technical Summary

Problems solved by technology

[0009] The technical problem to be solved by the present invention is to provide a new adapter plate with a metal vertical interconnection structure and its manufacturing method to solve the problems of high manufacturing cost and complicated process in the manufacturing process of three-dimensional stacked chips

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