Transfer plate with metal vertical interconnection structure and manufacture method thereof
A technology of vertical interconnection and manufacturing method, applied in the field of three-dimensional stacking, can solve the problems of complex process and high cost of manufacturing three-dimensional stacked chips, and achieve the effects of simplified process steps, simple structure and convenient operation.
Active Publication Date: 2012-04-18
NAT CENT FOR ADVANCED PACKAGING
4 Cites 27 Cited by
AI-Extracted Technical Summary
Problems solved by technology
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View moreAbstract
The invention discloses a transfer plate with a metal vertical interconnection structure and a manufacture method thereof. The transfer plate comprises a base plate, a passivation layer, a metal salient point structure and a metal interconnection wire, wherein the passivation layer is formed at the lower surface of the base plate, and the metal salient point structure is formed at the lower surface of the passivation layer. The metal salient point structure comprises a welding disc and a metal salient point, wherein the welding disc is buried inside the passivation layer, the metal salient point is formed on the lower surface of the welding disc, one part of the metal salient point is buried inside the passivation layer, and the other part of the metal salient point is exposed out of the lower surface of the passivation layer. The metal interconnection wire extends from the upper surface of the base plate to the lower surface of the base plate, penetrates through the whole base plate and passes through the passivation layer and the welding disc until reaching the inside of the metal salient point, so the metal salient point is electrically connected with devices arranged above the base plate through the metal interconnection wire. The transfer plate and the manufacture method have the advantages that the process is simple, the cost is low, and a high hole making qualified rate is realized, so the problems of high hole filling cost, complicated process and the like of the metal vertical interconnection structure are solved.
Application Domain
Technology Topic
Image
Examples
- Experimental program(2)
Example Embodiment
Example Embodiment
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more PUM
Property | Measurement | Unit |
Thickness | 10.0 | µm |
Thickness | 150.0 | nm |
Thickness | 1000.0 | nm |
tensile | MPa | |
Particle size | Pa | |
strength | 10 |
Description & Claims & Application Information
We can also present the details of the Description, Claims and Application information to help users get a comprehensive understanding of the technical details of the patent, such as background art, summary of invention, brief description of drawings, description of embodiments, and other original content. On the other hand, users can also determine the specific scope of protection of the technology through the list of claims; as well as understand the changes in the life cycle of the technology with the presentation of the patent timeline. Login to view more.
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more Similar technology patents
Radio communications system designed for a low-power receiver
ActiveUS20090111390A1Simple structureSmall sizeResonant long antennasElectric signal transmission systemsRadio receiverData information
Owner:BIOTRONIK SE & CO KG
Vacuum cleaner
Owner:NANJING LG PANDA APPLIANCES
Backlight device, liquid crystal display device, and electronic apparatus
ActiveUS20080111949A1Simple structureFew partsLighting heating/cooling arrangementsNon-linear opticsLiquid-crystal displayLiquid crystal
Owner:SATURN LICENSING LLC
Electronic cigarette device, electronic cigarette and atomizing device thereof
Owner:HUIZHOU KIMREE TECH
Mechanism for Osteosynthesis
InactiveUS20090234359A1Manufacturing cost be reduceSimple structureJoint implantsFastenersEngineeringOsteosynthesis
Owner:HIDETOSHI ONOUE +1
Classification and recommendation of technical efficacy words
- Simple structure
- Low production cost
Beam expanding optical element, beam expansion method, image display apparatus, and head-mounted display
InactiveUS20070188837A1Reduce color unevennessSimple structureOptical light guidesSubstrate with hologramHead worn displayLight wave
Owner:KONICA MINOLTA INC
Microlithographic projection exposure apparatus
InactiveUS20050068499A1Simple structureReliable and low-maintenance operationProjectorsPhotomechanical exposure apparatusCamera lensPhysics
Owner:CARL ZEISS SMT GMBH
Discharging apparatus for liquid crystal display
InactiveUS6903734B2Simple structureCathode-ray tube indicatorsNon-linear opticsLiquid-crystal displayGate driver
Owner:LG DISPLAY CO LTD
Intravascular obstruction removing wire and medical instrument
Owner:TERUMO KK +1