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Adhesive for chip multilayer ceramic capacitor and preparation method of adhesive

A multi-layer ceramic and adhesive technology, applied in the direction of non-polymer adhesive additives, adhesive additives, etc., can solve the problems of less internal defects and small breakdown ratio, and achieve less internal defects and small breakdown ratio , The effect of reducing the chip size

Inactive Publication Date: 2012-05-02
GUANGDONG FENGHUA ADVANCED TECH HLDG
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The technical problem solved by the present invention is to provide a kind of adhesive suitable for ceramic green film below 3um, which can inhibit ceramic green film The occurrence of poor sheet dispersion can reduce the insoluble matter of resin particles in the ceramic green film sheet. When the ceramic green film sheet is below 1-3um and the number of laminated layers is increased to 150-300 layers, a sheet-type multilayer with excellent performance can be formed. Ceramic capacitors, and have the characteristics of small breakdown ratio, high reliability, less internal defects, especially less voids in the dielectric layer

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0011] Adhesive production:

[0012] Add 40kg of toluene to the high-speed mixer, and then add 5kg of DOP (dioctyl phthalate), to make 15kg of molecular weight 11×10 4 The PVB resin powder (Sekisui Chemical Co., Ltd.) was slowly added at a certain rate, and a certain stirring speed was maintained during the process of adding the resin powder. After the PVB powder was completely dispersed, 40kg of ethanol was added. Stir at a certain shear rate for 6 to 20 hours, set the stirring speed to 20 m / sec, 30 m / sec, 40 m / sec, and 50 m / sec respectively, and use the liquid particle size analysis of the obtained adhesive The instrument detects the small solid particles in the adhesive solvent, and the results are shown in Table 1 below:

[0013] Table 1

[0014] Test serial number Stirring speed (m / sec) Cumulative solid particle volume (PPM) 1 20 0.065 2 30 0.042 3 40 0.024 4 50 0.021

[0015] The stirring speed is selected as 20 m / sec and 40 ...

Embodiment 2

[0026] Add 40kg of toluene into the high-speed mixer, and then add 5kg of DOP (dioctyl phthalate), and 15kg of the molecular weight is 9.5×10 4The PVB resin powder (Sekisui Chemical Co., Ltd.) was slowly added at a certain rate, and a certain stirring speed was maintained during the process of adding the resin powder. After the PVB powder was completely dispersed, 40kg of ethanol was added. Stir at a shear rate of 40 m / sec for 6 to 20 hours, and perform high-pressure dispersion treatment without high-pressure dispersion treatment, and perform high-pressure dispersion treatment with pressures of 4, 8, and 12 MPa respectively to prepare adhesives. The performance test results of the ceramic raw film sheet and chip multilayer ceramic capacitor made by the method of example 1 are shown in table 4:

[0027] Table 4

[0028] Test serial number Stirring speed (m / sec) High pressure treatment pressure setting (MPa) Binder Cumulative Solid Particle Volume (PPM) Short ...

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PUM

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Abstract

The invention relates to an adhesive for a chip multilayer ceramic capacitor and a preparation method of the adhesive. The adhesive consists of the following components by weight percent: 10-30 percent of polyvinyl butyral resin, 60-80 percent of solvent and 2-10 percent of plasticizer, wherein the molecular weight of the polyvinyl butyral resin is (8 to 12)*104; the solvent comprises aromatic solvent which takes a slightly soluble or swelling effect to resin powder and alcohol or lipid solvent which is used for dissolving the resin powder; and the plasticizer is one to two of phthalic acid ester and dibutyl sebacate. The adhesive can inhibit the poor dispersion of ceramic green diaphragms and can reduce resin particle insoluble substances in the ceramic green diaphragms. When the thickness of each ceramic green diaphragm is below 1-3mum and the number of the layers of the ceramic green diaphragms is increased to 150 to 300, the chip multilayer ceramic capacitor with a good performance can be formed and has the characteristics of small breakdown proportion, high reliability, fewer internal flaws and especially fewer voids in dielectric layers.

Description

technical field [0001] The invention relates to the technical field of preparation of ceramic capacitors, more specifically, the invention relates to an adhesive for chip multilayer ceramic capacitors and a preparation method thereof. Background technique [0002] The chip multilayer ceramic capacitor electronic component market has been developing steadily in recent years. From the perspective of high-capacity MLCC market share, high-capacity MLCC is eroding the market share of aluminum electrolytic capacitors, tantalum capacitors, and film capacitors. With the popularization of laptops, liquid crystal displays, and flat-panel TVs, 3G communication technology is gradually being promoted and applied nationwide, and the demand for high-reliability, large-capacity, small-size, and large-capacity chip multilayer ceramic capacitors is increasing. In order to make ceramic capacitors with small size and high specific capacity, the thickness of the dielectric must be developed towa...

Claims

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Application Information

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IPC IPC(8): C09J129/14C09J11/06
Inventor 李筱瑜陈长云安可荣韦豪任祝忠勇张尹卢艺森
Owner GUANGDONG FENGHUA ADVANCED TECH HLDG
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