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AlN-particle-reinforced copper composite heat sink material and preparation method thereof

A technology of heat sink material and particle reinforcement, applied in heat exchange equipment, lighting and heating equipment, electrical components, etc., can solve the problems of high cost and complicated preparation process, and achieve material cost reduction, simple preparation process, and good thermal matching Effect

Active Publication Date: 2012-05-02
HEILONGJIANG HEIKE TECH CO LTD +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The present invention aims to solve the technical problems of complex preparation process and high cost of the existing AlN particle reinforced copper composite heat sink material, and provides an AlN particle reinforced copper composite heat sink material and its preparation method

Method used

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specific Embodiment approach 1

[0013] Embodiment 1: An AlN particle reinforced copper composite heat sink material in this embodiment is composed of 1% to 15% of rare earth compounds with a particle size of 1 to 5 μm, and 10% to 70% of rare earth compounds with a particle size of 5 to 350 μm. AlN particles and 25% to 89% of electrolytic copper with a particle size of 5 to 350 μm; the rare earth compound is Y 2 o 3 , CaO, Ca 2 One or more combinations of F and SrO powders.

[0014] In the present embodiment, when the rare earth compound is a composition, various rare earth compounds are combined in any ratio.

[0015] The thermal conductivity of the AlN particle reinforced copper composite heat sink material in this embodiment is above 200w / mK, the density is above 98%, and the coefficient of thermal expansion is ≤14ppm / K. It can achieve good thermal matching with semiconductor materials and ceramic materials commonly used in the current electronics industry, and can be used as a new generation of heat si...

specific Embodiment approach 2

[0016] Specific embodiment 2: The difference between this embodiment and specific embodiment 1 is that the AlN particle-reinforced copper composite heat sink material is composed of 5%-10% of rare earth compounds with a particle size of 2-4μm, 20%-60% of AlN particles with a particle size of 20-300 μm and 30% to 75% of electrolytic copper with a particle size of 20-300 μm. Others are the same as in the first embodiment.

specific Embodiment approach 3

[0017] Specific implementation mode three: the preparation method of the AlN particle reinforced copper composite heat sink material described in the first implementation mode is carried out according to the following steps:

[0018] 1. Weigh 1% to 15% of rare earth compounds with a particle size of 1 to 5 μm, 10% to 70% of AlN particles with a particle size of 5 to 350 μm, and 25% to 89% of AlN particles with a particle size of 5 to 350 μm by mass percentage. Electrolytic copper; then weigh stearic acid according to 1% to 5% of the sum of the mass of rare earth compounds, AlN particles and electrolytic copper; wherein the rare earth compound is Y 2 o 3 , CaO, Ca 2 One or more combinations of F and SrO powder;

[0019] 2. The rare earth compound, AlN particles, electrolytic copper and stearic acid weighed in step 1 are added to the ball mill, wherein the mass ratio of the ball to material is 10: (1~2), and under the protection of nitrogen or argon, the ball mill is heated at...

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Abstract

The invention relates to a heat sink material and a preparation method thereof, and in particular relates to an AlN-particle-reinforced copper composite heat sink material and a preparation method thereof. The invention aims to solve the technical problems that the existing AlN-particle-reinforced copper composite heat sink material has complex preparation process and high cost. The composite heat sink material is prepared from a rare earth compound, AlN particles and electrolytic copper, wherein the rare earth compound is Y2O3 powder. The method comprises the following steps: performing ball milling to the rare earth compound, AlN particles, electrolytic copper and stearic acid, then prepressing to obtain a preform, preburning the preform, and then roasting at 900-1300 DEG C to obtain the AlN-particle-reinforced copper composite heat sink material. The heat conductivity of the material is more than 200w / mK, the compactness is more than 98% and the thermal expansion coefficient is no more than 14ppm / K; and the heat sink material can be used in electronic packaging.

Description

technical field [0001] The invention relates to a heat sink material and a preparation method thereof. Background technique [0002] With the rapid development of modern electronic technology, high-power electronic components are gradually developing towards higher integration, faster operation speed and larger capacity. This will inevitably lead to an increase in the heat generation of the circuit, and the operating temperature will continue to rise. Generally speaking, in semiconductor devices, the probability of failure increases by 2 to 3 times for every 18°C ​​increase in temperature. In order to ensure the reliability of electronic components, the heat generated must be conducted through the heat sink or packaging material, which requires the heat sink material to have high thermal conductivity (generally requires thermal conductivity higher than 120Wm -1 K -1 ). On the other hand, since the heat sink is directly connected to the semiconductor chip, its thermal exp...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C22C29/00C22C32/00C22C9/00C22C1/05F28F21/00H01L23/29
Inventor 宋美慧李岩于倩
Owner HEILONGJIANG HEIKE TECH CO LTD
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