thin film structure
A thin-film structure and thin-film technology, applied in optics, instruments, optical components, etc., can solve problems such as operator and environmental damage and pollution
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Embodiment 1
[0048] First, a tin target material is provided, the purity of which is 99%, and the used tin target material is a tin target material with a diameter of six. Next, a ceramic substrate with a smooth and flat surface is provided. Subsequently, the ceramic substrate was placed in a vacuum magnetron sputtering chamber, and an argon gas was introduced into the chamber, and the flow rate of the introduced argon gas was set to 20 sccm. Then, the above-mentioned tin target was sputtered onto the ceramic substrate with a DC magnetron target, and the sputtering power was set to 700 watts. The area of the tin foil film test piece deposited on the surface of the corresponding ceramic substrate is 25 cm*25 cm and the thickness is 900 nm. The deposition area and thickness of the above-mentioned test piece are only used for testing purposes and are not intended to limit the present invention, and the deposited area and thickness will not affect the coloration of the film. Then use atomi...
Embodiment 2
[0051] First, an aluminum target is provided, the purity of which is 99%, and the used aluminum target is an aluminum target with a diameter of two. Next, a glass substrate with a smooth and flat surface is provided. Subsequently, the glass substrate was placed in a vacuum magnetron sputtering chamber, and an argon gas was introduced into the chamber, wherein the flow rate of the introduced argon gas was set to 15 sccm. Then, the above-mentioned aluminum target was sputtered onto the glass substrate with a DC magnetron target, and the sputtering power was set to 50 watts. The aluminum thin film test piece deposited on the surface of the corresponding glass substrate has an area of 25 cm*25 cm and a thickness of 1000 nm. The deposition area and thickness of the above-mentioned test piece are only used for testing purposes and are not intended to limit the present invention, and the deposited area and thickness will not affect the coloration of the film. Then use atomic forc...
Embodiment 3
[0055]First, an indium target material is provided, the purity of which is 99%, and the used indium target material is an indium target material with a diameter of six. Next, a stainless steel substrate with a smooth and flat surface is provided. Subsequently, the stainless steel substrate was placed in a vacuum magnetron sputtering chamber, and an argon gas was introduced into the chamber, and the flow rate of the introduced argon gas was set at 20 sccm. Then, the above-mentioned indium target was sputtered onto the stainless steel substrate with a DC magnetron target, and the sputtering power was set to 500 watts. The area of the indium film test piece deposited on the surface of the corresponding stainless steel substrate is 50 cm*50 cm and the thickness is 1200 nm. The deposition area and thickness of the above test piece are only for testing purposes, not for limiting the present invention. The deposited area and thickness did not affect the color rendering of the film...
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Abstract
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