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Multilayer single-face aluminum-based circuit board and manufacturing method thereof

An aluminum-based circuit board, single-sided technology, applied in the fields of printed circuit manufacturing, chemical instruments and methods, layered products, etc., can solve problems such as poor thermal conductivity, temperature rise of circuit boards, and hindrance of heat conduction of inner layer boards , to improve the effect of heat conduction, increase the contact surface, and improve the effect of heat conduction

Inactive Publication Date: 2012-05-09
秦会斌
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] At present, ordinary adhesives or prepregs used in the manufacture of rigid multilayer circuit boards only have good adhesion and insulation properties, and poor thermal conductivity.
This hinders the conduction of heat from the inner board to the outer board, thereby increasing the temperature of the entire circuit board

Method used

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  • Multilayer single-face aluminum-based circuit board and manufacturing method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0028] A three-layer single-sided aluminum-based circuit board is prepared by the following method:

[0029] (1) Preparation of epoxy resin glue: prepare glue with high vitrification epoxy resin, phenolic resin, dimethylimidazole and acetone according to the following weight components, mix evenly and mature for 2 to 6 hours;

[0030] 100 parts of high vitrification epoxy resin;

[0031] 40 parts of phenolic resin;

[0032] 0.03 parts of dimethylimidazole;

[0033] 60 parts of acetone;

[0034] (2) Preparation of nano-inorganic composite fillers: taking the quality of epoxy resin as a benchmark, silicon carbide, aluminum oxide and silicon dioxide are configured with fillers according to the following weight components, and mixed uniformly;

[0035] 30 parts of silicon carbide;

[0036] 11 parts of aluminum oxide;

[0037] 4 parts of silicon dioxide;

[0038] (3) Prepare a high thermal conductivity insulating adhesive solution: add all the nano-inorganic composite filler...

Embodiment 2

[0042] A four-layer single-sided aluminum-based circuit board is prepared by the following method:

[0043] (1) Prepare epoxy resin glue: prepare glue with high vitrification epoxy resin, phenolic resin, dimethylimidazole and acetone according to the following weight components, mix evenly and mature for 2 hours;

[0044] 100 parts of high vitrification epoxy resin;

[0045] 40 parts of phenolic resin;

[0046] 0.03 parts of dimethylimidazole;

[0047] 60 parts of acetone;

[0048] (2) Preparation of nano-inorganic composite filler: based on the quality of epoxy resin, silicon carbide, aluminum oxide and silicon dioxide are configured as fillers according to the following weight components, and mixed uniformly;

[0049] 30 parts of silicon carbide;

[0050] 10 parts of aluminum oxide;

[0051] 5 parts of silicon dioxide;

[0052] (3) Prepare a high thermal conductivity insulating adhesive solution: add all the nano-inorganic composite fillers prepared in step 2 to the e...

Embodiment 3

[0056] A six-layer single-sided aluminum-based circuit board is prepared by the following method:

[0057] (1) Prepare epoxy resin glue: prepare glue with high vitrification epoxy resin, phenolic resin, dimethylimidazole and acetone according to the following mass components, mix well and mature for 2 hours;

[0058] 100 parts of high vitrification epoxy resin;

[0059] 40 parts of phenolic resin;

[0060]0.03 parts of dimethylimidazole;

[0061] 60 parts of acetone;

[0062] (2) Prepare nano-inorganic composite fillers: prepare fillers with silicon carbide, alumina and silicon dioxide according to the following mass components, and mix them evenly;

[0063] 29 parts of silicon carbide;

[0064] 9 parts of aluminum oxide;

[0065] 7 parts of silicon dioxide;

[0066] (3) Prepare a high thermal conductivity insulating adhesive solution: add all the nano-inorganic composite fillers prepared in step 2 to the epoxy resin glue prepared in step 1, and mix evenly;

[0067] (4)...

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Abstract

The invention relates to a multilayer single-face aluminum-based circuit board, which is characterized by being manufactured by using a method comprising the following steps of: (1) preparing an epoxy resin glue solution; (2) preparing nanometer inorganic composite filler; (3) preparing a high-heat-conduction insulated adhesive solution; (4) soaking glass fiber cloth in the high-heat-conduction insulated adhesive solution and drying to obtain prepregs; and (5) manufacturing the multilayer single-face aluminum-based circuit board: respectively manufacturing an inner layer board and an outer layer board from a plurality of prepregs manufactured in the step (4) and copper foils and aluminum plates according to a conventional general method, and laminating and pressing to obtain the multilayer single-face aluminum-based circuit board. The multilayer single-face aluminum-based circuit board has a favorable heat dissipation effect; when the weight part ratio of epoxy resin to the nanometer inorganic composite filler is 100: 45, the heat conduction effect of the insulated bonding layer is optimal; the nanometer inorganic filler is filled in the epoxy region adhesive instead of the common filler, the heat conduction effect of the insulated bonding layer is greatly promoted.

Description

technical field [0001] The invention relates to a multilayer single-sided aluminum-based circuit board, in particular to a multilayer single-sided aluminum-based circuit board in the field of circuit board manufacturing and a manufacturing method thereof. Background technique [0002] With the rapid development of science and technology, people's requirements for electronic products continue to develop in the direction of high performance, multiple functions, and small size, thus further requiring increased packaging density. Due to the limitation of space, it is impossible to further increase the assembly density of single- and double-sided circuit boards, which provides development space for multi-layer circuit boards. [0003] Single-sided multilayer circuit board refers to a circuit board composed of more than 3 layers of single circuit boards, separated by insulating adhesive layers, laminated and bonded, and the conductive patterns between the layers are connected as r...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K3/00B32B17/04B32B27/04B32B15/08B32B15/20C08L63/00C08K13/04C08K7/14C08K3/34C08K3/22C08K3/36
Inventor 秦会斌郑鹏秦惠民
Owner 秦会斌
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