Low dielectric constant glass fiber

Abstract

The invention provides a low dielectric constant glass fiber. The low dielectric constant glass fiber comprises the following components in percentage by weight: 48-58% of SiO2, 10-18% of Al2O3, 18-28% of B2O3, 0-6% of CaO, 0-6% of MgO, 0.5-8% of Y2O3, 0.2-0.6% of CeO2, 0-3% of F2, 0-1% of Na2O, K2O and Li2O, 0-0.45% of TiO2 and 0-0.5% of FeO3. It is shown by experiment that the glass fiber provided by the invention has the advantages of good manufacturability, operability, water resistance, lower dielectric property and lower dielectric loss; the dielectric property of the glass fiber is similar to that of a glass fiber D and superior to that of a glass fiber E; and the water resistance of the glass fiber is equivalent to that of the glass fiber E and largely superior to that of the glass fiber D.

Description

technical field [0001] The invention belongs to the technical field of glass fibers, in particular to a glass fiber with low dielectric constant. Background technique [0002] With the rapid development of the electronic information industry, printed circuit boards are gradually developing in the direction of high density, multi-layer, and super-multi-layer. It is used as a built-in passive component in a multi-layer board. In order to realize the above-mentioned many functions, the copper clad laminate material needs to have a lower dielectric constant and dielectric loss, so that the printed circuit board has a fast propagation speed and a small propagation loss. Printed circuit boards are usually composed of resin and glass fiber. The resin used for printed circuit boards generally has good dielectric properties and can meet the needs of printed circuit boards. The dielectric properties of glass fibers are inferior to those of resins, which restricts the use of printed c...

AI Technical Summary

Problems solved by technology

[0003] At present, the low-dielectric glass fibers commonly used at home and abroad are mainly E glass fibers and D glass fibers. Among them, the composition of E glass fibers is: 52-56% SiO 2 , 12-16% Al 2 o 3 , 5-10% of B 2 o 3 , 16-25% CaO, 0-5.0% MgO, 3-5% Na 2 O+K 2 O, E glass fiber has the advantages of good processability, good water resistance, and low price, but its dielectric constant is high, about 6.7, and its dielectric loss is large, greater than 10 -3 , cannot meet the requirements of high density and high-speed information processing

The composition of D glass fiber is: 72-76% SiO 2 , 0~5% Al 2 o 3 , 20-25% B 2 o 3 , 3~5% Na 2 O+K 2 O, its dielectric constant is about 4.1, and its dielectric loss is 8×10 -4 Or so, but D glass fiber has the following disadvantages: (1) Compared with E glass fiber, D glass fiber has a higher content of SiO 2 , leading to poor drilling performance of D glass fiber reinforced laminates, which is not conducive to subsequent processing; (2) D glass fiber has a high glass softening point and poor melting property, and it is easy to produce veins and air bubbles, resulting in difficulties in drawing operations. There are many broken glass fibers in the silk process, so the productivity and workability are very poor, the production cost is high, and it is not easy to produce on a large scale; (3) D glass fiber has a very high melting temperature and drawing temperature, generally at 1400 Above ℃, the quality requirements of the kiln are very strict, which will reduce the life of the kiln; (4) D glass fiber has poor water resistance, and it is easy to cause the fiber and resin to peel off

[0007] The Chinese patent document with the application number CN200610166224.5 discloses a low dielectric constant glass fiber, which consists of 50-60% SiO 2 , 6-9.5% Al 2 o 3 , 30.5-35% B 2 o 3 , 0-5% CaO, 0-5% ZnO, 0.5-5% TiO 2 , among them, ZnO replaces part of CaO and MgO to reduce the dielectric constant, the dielectric constant is 3.9-4.4, and the dielectric loss is 4×10 -4 ~8.5×10 -4 , however, the drawing temperature of the glass fiber is higher, generally greater than 1350°C, and its B 2 o 3 The high content will not only pollute the environment, but also easily lead to large fluctuations in composition and increase corrosion of the kiln. In addition, the water resistance of the glass fiber is also poor;

[0008] The Chinese patent document with application number 200910216020.1 discloses a low dielectric constant glass fiber, which consists of 50-60% SiO 2 , 12-18% Al 2 o 3 , 21-27% B 2 o 3 , 0-1.8% CaO, 0.5-3.2% MgO, 0.5-3.2% ZnO, 0.4-4% TiO 2 , 0.5% ~ 3% CaF 2 , 0.2% to 0.6% CeO, the glass fiber has the advantages of good water resistance, good adhesion with resin, easy subsequent processing, and a dielectric constant of 4.2-4.6, but its dielectric loss is still high, 10×10 -4 12×10 -4 , and TiO 2 High content is not good for glass color

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