Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Urethanation modified hybrid phenolic resin and preparation method thereof

A technology of novolac resin and phenolic resin, which is applied in the field of urethane-modified hybrid phenolic resin for heat-sensitive CTP plates and its preparation, which can solve the problem of poor solvent resistance and printing resistance of heat-sensitive plates, resin and plate The impact of alkali solubility of materials and other issues, to achieve the effect of improving the printing resistance

Active Publication Date: 2012-06-20
LUCKY HUAGUANG GRAPHICS
View PDF8 Cites 9 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0014] The purpose of the present invention is to solve the shortcomings of poor solvent resistance and printing durability of the thermal plate in the existing thermal plate technology, especially to improve the solvent resistance and printing durability of the plate through the method of phenolic resin modification. Due to the partial closure of phenolic hydroxyl groups, the alkali solubility of resins and plates will be affected.

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Urethanation modified hybrid phenolic resin and preparation method thereof
  • Urethanation modified hybrid phenolic resin and preparation method thereof
  • Urethanation modified hybrid phenolic resin and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0075] Example 1 (phenolic resin P01, modified phenolic resin P01M)

[0076] Add 565.7 g of DMAC (N, N-dimethylacetamide) and 200.0 g of phenolic resin to a 1000 ml four-necked flask with temperature-controlled heating, mechanical stirring, reflux and nitrogen protection device P01 (commodity code: MV4020G, m / p=60 / 40, Mw≈14000), heated and stirred at 60°C under nitrogen atmosphere until the solid was dissolved, then added 1.0g of dibutyltin dilaurate, and then slowly added 26.3g of MOI (methacryloyl Oxyethyl isocyanate) was reacted for 4 hours until the peak at 2275 of the active isocyanate group detected by infrared spectroscopy disappeared.

[0077] 1.2 g of AIBN (azobisisobutyronitrile) was added to the above reaction solution, and the reaction was completed after 23 hours at 70°C. The reactant was precipitated in deionized water, washed, and vacuum-dried at 40°C to obtain homopolymerized modified phenolic resin P01M. See the following table for performance.

Embodiment 2

[0078] Example 2 (phenolic resin P02, modified phenolic resin P02M)

[0079] Add 1091 g of DMAC (N, N-dimethylacetamide) and 200.0 g of phenolic resin to a 1500 ml four-necked flask with temperature-controlled heating, mechanical stirring, reflux and nitrogen protection device P02 (commodity code: EPR6040A, m / p=40 / 60, Mw≈2500), heated and stirred at 60°C under nitrogen protection until the solid dissolved, then added 1.0g of dibutyltin dilaurate, and then slowly added 236.4g of MOI (methacryloyl Oxyethyl isocyanate) was reacted for 4 hours until the peak at 2275 of the active isocyanate group detected by infrared spectroscopy disappeared.

[0080] 2.2 g of AIBN (azobisisobutyronitrile) was added to the above reaction liquid, and the reaction was completed after 23 hours at 70°C. The reactants were precipitated in deionized water, washed, and vacuum-dried at 40°C to obtain homopolymerized modified phenolic resin P02M. See the following table for performance.

Embodiment 3

[0081] Example 3 (phenolic resin P03, modified phenolic resin P03M)

[0082] Add 598.5 g of DMAC (N, N-dimethylacetamide) and 200.0 g of phenolic resin to a 1000 ml four-necked flask with temperature-controlled heating, mechanical stirring, reflux and nitrogen protection device P03 (commodity code: TR4020G, m / p=60 / 40, Mw≈13000), heated and stirred at 60°C under nitrogen protection until the solid was dissolved, then added 1.0g of dibutyltin dilaurate, and then slowly added 39.4g of MOI (methacryloyl Oxyethyl isocyanate) was reacted for 4 hours until the peak at 2275 of the active isocyanate group detected by infrared spectroscopy disappeared.

[0083] 26.6g MI (maleimide), 66.5g dried DMAC, 1.3g AIBN (azobisisobutyronitrile) were added to the above reaction solution, and the reaction was completed after 23 hours at 70°C. The reactant was precipitated in deionized water, washed, and vacuum-dried at 40°C to obtain a copolymerized modified phenolic resin P03M. See the following...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

Urethanation modified hybrid phenolic resin is prepared through the following steps: the grafting of linear phenolic resin and ethylene monoisocyanates is conducted through the phenol hydroxyl urethanation reaction, then the linear phenolic resin serves as a high-polymer monomer to conduct the second radical linear polymerization independently or jointly with other ethylene monomers to obtain the hybrid phenolic resin; the weight-average molecular weight of the urethanation modified hybrid phenolic resin is 7.500 to 150.000; and the temperature of the softening point is 80 to 220 DEG C. The urethanation modified hybrid phenolic resin is used for thermosensitive flat printing plates, and can obviously enhance the solvent resistance and the durability of the thermal plate due to the existence of strongly polar urethane links, and the flat printing plate has the advantages of strong coating adhesion and toughness.

Description

technical field [0001] The invention belongs to the technical field of printing, and in particular relates to a urethane-modified hybrid phenolic resin for heat-sensitive CTP plates and a preparation method thereof. Background technique [0002] Lithographic printing technology has moved from traditional laser phototypesetting film copying PS plate technology to computer-to-plate technology (CTP technology for short), and CTP plate materials are gradually becoming popular. There are many types of CTP plates, and the more popular ones include silver salt diffusion CTP plates, UV-CTP plates, purple laser polymerization CTP plates, thermal CTP plates, etc. The most widely used one is thermal CTP plate. At present, further improving the performance of heat-sensitive CTP plates, especially improving the solvent resistance and printing resistance of plates is a hot spot in the development of heat-sensitive CTP plates. [0003] Plate material solvent resistance means that the pri...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
IPC IPC(8): C08F120/36C08F220/36C08F222/40C08F220/58C08F226/02C08F212/14C08G8/30
Inventor 宋小伟张刚高英新杨青海高峰张攀张萌
Owner LUCKY HUAGUANG GRAPHICS
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com