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Fast cured thermal conductive adhesive and preparation method thereof

A technology of thermally conductive adhesive and thermally conductive particles, used in adhesives, non-polymer organic compound adhesives, non-polymer adhesive additives, etc., can solve the problems of slow curing, slow curing speed, improper ratio, etc. The effect of interface wetting ability, preventing quality problems and saving time and cost

Active Publication Date: 2012-06-20
TIF ADVANCED MATERIALS SHANGHAI
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The single-component moisture-curing silicone thermally conductive adhesives that are ubiquitous in the market currently have slow curing (although they can be surface-dried within 10-30 minutes, but complete curing takes 3-7 days), which cannot meet the current industrial production requirements. High-speed and multi-variation requirements. In addition, the shear strength (also called bonding strength) after curing is weak, especially for some polar substrate surfaces, such as metal, ceramics, glass, etc.
[0005] However, the two-component thermally conductive adhesives that are ubiquitous in the market have a slow curing speed, and the two components are used together on site when used. On the one hand, the requirements for the ratio of the two components are relatively strict; The two components are fully stirred evenly; otherwise, there may be a risk of incomplete curing or even no curing due to improper proportioning or uneven stirring

Method used

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  • Fast cured thermal conductive adhesive and preparation method thereof
  • Fast cured thermal conductive adhesive and preparation method thereof
  • Fast cured thermal conductive adhesive and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0041] The components and weight percentages of the thermally conductive adhesive are as follows:

[0042]

[0043] The modified acrylic resin is tetrahydrofuryl methacrylate;

[0044] The thermally conductive particles are alumina particles with a particle size range of 3-5um;

[0045] The curing initiator is benzoyl peroxide tert-butyl;

[0046] The modified resin is methacrylate-butadiene-styrene copolymer;

[0047] The thixotropic agent is fumed silicon R720;

[0048] The storage stabilizer is 2,6-di-tert-butyl-p-cresol;

[0049] Specific preparation method:

[0050] Add modified acrylic resin, heat-conducting particles, modified resin, antioxidant 1076, and thixotropic agent into the planetary dynamic mixer according to the above formula ratio, and mix and stir evenly (stirring speed range, stirring time is about half an hour, and the obtained stirring mixture in paste form);

[0051] Pour it into a three-roller grinder and grind it 3 times until the mixture is c...

Embodiment 2

[0054] The components and weight percentages of the thermally conductive adhesive are as follows:

[0055]

[0056] The modified acrylic resin is a mixture of tetrahydrofuryl methacrylate and hydroxypropyl methacrylate;

[0057] The particle size range of thermally conductive particles boron nitride is 3um-10um, and the particle size range of thermally conductive particles alumina is 2um-5um;

[0058] Curing initiator is the mixture that the mass ratio of benzoyl peroxide and benzoyl tert-butyl peroxide is 2:1;

[0059]The additional resin is styrene-butadiene rubber;

[0060] The thixotropic agent is fumed silicon R720;

[0061] The storage stabilizer is a mixture of 2,6-di-tert-butyl-p-cresol and p-benzoquinone (mass ratio=1:1);

[0062] The preparation process is the same as in Example 1.

Embodiment 3

[0064] The components and weight percentages of the thermally conductive adhesive are as follows:

[0065]

[0066] The modified acrylic resin is a mixture of tetrahydrofuryl methacrylate and hydroxypropyl methacrylate in a mass ratio of 3:1;

[0067] The particle size range of thermally conductive particles boron nitride is 3um-10um, and the particle size range of thermally conductive particles alumina is 2um-5um;

[0068] Curing initiator is the mixture that the mass ratio of benzoyl peroxide and benzoyl tert-butyl peroxide is 2:1;

[0069] The additional resin is methacrylate-butadiene-styrene copolymer;

[0070] The thixotropic agent is fumed silicon R720;

[0071] The storage stabilizer is a mixture of 2,6-di-tert-butyl-p-cresol and p-benzoquinone (mass ratio=1:1);

[0072] The preparation process is the same as in Example 1.

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PUM

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Abstract

The invention relates to a thermal conductive adhesive and a preparation method thereof. The thermal conductive adhesive comprises 10 to 45 weight percent of modified acrylic resin, 50 to 85 weight percent of thermal conductive particles and 1 to 5 weight percent of curing initiator. Compared with the existing single-component thermal conductive adhesive, the thermal conductive adhesive disclosed by the invention can be suitable for surfaces of polar substrates such as metal, ceramic and glass, has high cutting speed after being cured and has high curing speed. Compared with the existing two-component thermal conductive adhesive, the thermal conductive adhesive disclosed by the invention has high curing speed and high cutting strength after being cured on one hand, and has no risk of incomplete curing caused by improper proportioning or nonuniform stirring on the other hand. The thermal conductive adhesive can be used for thermal conductive connection between various heat source generators and a radiator.

Description

technical field [0001] The invention belongs to the field of adhesives, and in particular relates to a modified acrylic heat-conducting adhesive and a preparation method thereof. Background technique [0002] With the vigorous development of electronic technology in the 21st century, the heat density of various electronic components is getting higher and higher, and the heat dissipation problem has become a crucial consideration in the design of electronic products. [0003] All kinds of heat source generators and heat sinks are connected by heat conduction adhesives, such as heat dissipation design in semiconductor, power supply, white goods and LED industries. [0004] The single-component moisture-curing silicone thermally conductive adhesives that are ubiquitous in the market currently have slow curing (although they can be surface-dried within 10-30 minutes, but complete curing takes 3-7 days), which cannot meet the current industrial production requirements. High spee...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J4/02C09J4/06C09J9/00C09J11/04
Inventor 邓志军王新宏
Owner TIF ADVANCED MATERIALS SHANGHAI
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